lp2980im5-1.8 National Semiconductor Corporation, lp2980im5-1.8 Datasheet - Page 13

• Manufacturer Part Number: lp2980im5-1.8
• Description: Ic Reg Ldo Micropower Sot23-5
• Manufacturer: National Semiconductor Corporation

NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTER CLOCK-
WISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACK-
AGE HEIGHT.
6.NO JEDEC REGISTRATION AS OF AUG.1999.
For Order Numbers, refer to Table 1in the “Ordering Information” section of this document.
101091 Version 6 Revision 1
The dimensions for X1, X2 and X3 are as given:
micro SMD, 5 Bump, Package (BPA05)
NS Package Number BPA05A
X1 = 0.930 +/− 0.030mm
X2 = 1.107 +/− 0.030mm
X3 = 0.850 +/− 0.050mm
Print Date/Time: 2008/12/05 10:23:42
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