lnk562 Power Integrations, Inc., lnk562 Datasheet
lnk562
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lnk562 Summary of contents
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... EMI, minimizing fi lter cost. ® Figure 1. Typical Application – not a Simplifi ed Circuit (a) and PRODUCT LNK562P/G/D LNK563P/G/D LNK564P/G/D Table 1. Output Power Table. Notes: 1. Output power may be limited by specifi c application parameters including core size and Clampless operation (see Key Application Considerations) ...
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... Oscillator The typical oscillator frequency is internally set to an average of 66/83/100 kHz for the LNK562, 563 & 564 respectively. Two signals are generated from the oscillator: the maximum duty cycle signal (DC the beginning of each switching cycle. ...
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... MOSFET when the BYPASS pin voltage drops below 4.85 V. Once the BYPASS pin voltage drops below 4. must rise back to 5 enable (turn on) the power MOSFET. LNK562-564 Over-Temperature Protection The thermal shutdown circuitry senses the die temperature. The threshold is set at 142 °C typical with a 75 °C hysteresis. ...
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... LNK562-564 D1 L1 RF1* 3300 μH 8.2 Ω 1N4937 L J-1 2.5 W 90-265 10 μF VAC 400 V J 1N4005 LinkSwitch-LP U1 LNK564P Figure 330 mA CV/CC Linear Replacement Power Supply. Applications Example The circuit shown in Figure typical implementation 330 mA, constant voltage, constant current (CV/CC) output power supply. ...
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... This effectively fi lters the leakage inductance spike and reduces the error that this would give when using fast recovery time diodes. The use of a slow diode is a requirement in Clampless designs. LNK562-564 O of ≤ ≤ two-layer primary must be O ≤ ...
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... LNK562-564 TOP VIEW Output Filter Capacitor Figure 6. Recommended Circuit Board Layout for LinkSwitch-LP using P Package (Assumes a HVDC Input Stage). LinkSwitch-LP Layout Considerations Layout See Figure 6 for a recommended circuit board layout for LinkSwitch-LP (P & G package). Single Point Grounding Use a single point ground connection from the input fi ...
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... LinkSwitch-LP SOURCE pin temperature of 100 °C is recommended to allow for these variations. does not exceed DS Design Tools specifi cation gives DSS Up-to-date information on design tools can be found at the Power Integrations web site: www.powerint.com. LNK562-564 S S Input Filter S Capacitor ...
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... Measured on pin 2 (SOURCE) close to plastic interface. 2. Measured on pin 8 (SOURCE) close to plastic interface. 3. Soldered to 0.36 sq. in. (232 mm (3) ( °C/W 4. Soldered to 1 sq. in. (645 mm Conditions SOURCE = -40 to 125 °C J See Figure 8 (Unless Otherwise Specifi ed) LNK562 °C J Average LNK563 V =1. LNK564 ° ...
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... See Note ° 100 ° 6 ≥ 560 ° 6 ≥ See Note °C J See Figure 10 LNK562-564 Min Typ Max Units -5.5 -3.3 -1.8 mA -3.8 -2.3 -1.0 5.55 5.8 6.10 V 0.8 0.95 1 μA 124 136 148 mA 1099 1221 1380 ...
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... LNK562-564 Parameter Symbol OUTPUT (cont.) FEEDBACK Pin Auto-Restart V FB(AR) Threshold Voltage Auto-Restart ON-Time Auto-Restart DC Duty Cycle AR NOTES scheme using a resistor divider network at the FB pin, where R bias voltage and R is the resistor from the FB pin to the SOURCE pin, the output voltage variation is infl uenced ...
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... MAX (internal signal DRAIN OSC Figure 10. Output Enable Timing. 100 2 μs 0 -100 Time (μs) Figure 11. Peak Negative Pulsed DRAIN Current Waveform. LNK562-564 470 kΩ 0.1 μF PI-3490-060204 PI-3707-112503 11 Rev. G 02/07 ...
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... LNK562-564 Typical Performance Characteristics 1.1 1.0 0.9 -50 - 100 125 150 Junction Temperature (°C) Figure 12. Breakdown vs. Temperature. 1.4 1.2 1.0 0.8 0.6 0.4 0 Temperature (°C) Figure 14. Current Limit vs. Temperature 0.2 0.4 0.6 Time (ms) Figure 16. BYPASS Pin Startup Waveform. 12 Rev. G 02/07 1.2 1.0 0.8 0.6 0.4 0.2 0 Figure 13. Frequency vs. Temperature. 1.1 1.0 0.9 100 150 Figure 15 ...
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... Plastic Surface Mount DIP P Plastic DIP D Plastic SO-8 Lead Finish N Pure Matte Tin (Pb-Free) Tape & Reel and Other Options Blank Standard Confi gurations Tape & Reel pcs minimum for G Package. 2.5 k pcs TL for D Package. Not available for P Package. LNK562-564 600 Rev. G 02/07 13 ...
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... LNK562-564 ⊕ .004 (.10) -E- .240 (6.10) .260 (6.60) Pin 1 .367 (9.32) -D- .387 (9.83) .125 (3.18) .145 (3.68) -T- SEATING PLANE .100 (2.54) BSC .014 (.36) ⊕ .010 (.25) M .022 (.56) ⊕ .004 (.10) -E- .240 (6.10) .260 (6.60) Pin 1 .100 (2.54) (BSC) .367 (9.32) -D- .387 (9.83) .125 (3.18) .145 (3.68) .032 (.81) .048 (1.22) .037 (.94) .053 (1.35) 14 Rev. G 02/07 ...
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... Package outline exclusive of mold flash and metal burr. 4.90 (0.193) 3. Package outline inclusive of plating thickness. 4. Datums A and determined at datum plane H. 5. Controlling dimensions are in millimeters. Inch dimensions + are shown in parenthesis. Angles in degrees. 0.60 (0.024) LNK562-564 DETAIL A GAUGE PLANE 0.25 (0.010) BSC 0.40 (0.016) 1 ...
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... LNK562-564 Revision Notes E 1) Final Release Data Sheet F 2) Revision of PI-3924 G 1) Added SO-8C Package For the latest updates, visit our website: www.powerint.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein ...