ncp1521b ON Semiconductor, ncp1521b Datasheet - Page 13

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ncp1521b

Manufacturer Part Number
ncp1521b
Description
1.5 Mhz, 600 Ma Stepdown Dcdc Converter
Manufacturer
ON Semiconductor
Datasheet

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2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
C A B
1.0
0.037
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
J
CASE 483-02
NCP1521B
K
TSOP-5
ISSUE F
0.074
DETAIL Z
1.9
13
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
A
B
C
D
G
H
K
M
S
J
L
inches
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_

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