stm8af6169tdy STMicroelectronics, stm8af6169tdy Datasheet - Page 88

• Manufacturer Part Number: stm8af6169tdy
• Description: Automotive 8-bit Mcu, With Up To 128 Kbytes Flash, Data Eeprom, 10-bit Adc, Timers, Lin, Can, Usart, Spi, I2c, 3 To 5.5 V
• Manufacturer: STMicroelectronics

Electrical characteristics
10.4
10.4.1
88/106
Thermal characteristics
In case the maximum chip junction temperature (T
operating conditions
T
Equation 3
where:
where:
Equation 4
taking into account the actual V
application.
Table 50.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Jmax
environment.
Symbol
T
Θ
P
P
internal power.
P
, in degrees Celsius, may be calculated using the following equation:
Θ
Θ
Θ
Θ
Amax
Dmax
INTmax
I/Omax
JA
JA
JA
JA
JA
is the package junction-to-ambient thermal resistance in ° C/W
is the maximum ambient temperature in °C
is the sum of P
Thermal characteristics
represents the maximum power dissipation on output pins
is the product of I
Thermal resistance junction-ambient
LQFP 80 - 14 x 14 mm
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
is exceeded, the functionality of the device cannot be guaranteed.
P
INTmax
I/Omax
T
Doc ID 14395 Rev 8
DD
OL
Jmax
= Σ (V
and P
and V
/ I
Parameter
OL
= T
(1)
and V
OL
I/Omax
DD
Amax
, expressed in Watts. This is the maximum chip
* I
OH
OL
+ (P
(P
) + Σ((V
/ I
Dmax
Dmax
OH
Jmax
of the I/Os at low- and high-level in the
= P
) specified in
x Θ
DD
STM8AF52/62xx, STM8AF51/61xx
INTmax
- V
JA
)
OH
) * I
+ P
OH
I/Omax
Table 25: General
)
Value
38
46
57
59
)
°C/W
°C/W
°C/W
°C/W
Unit