ncp5304 ON Semiconductor, ncp5304 Datasheet

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ncp5304

Manufacturer Part Number
ncp5304
Description
Dual Inputs High Voltage High And Low-side Mosfet Or Igbt Drivers
Manufacturer
ON Semiconductor
Datasheet

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ncp5304DR2G
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ncp5304PG
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NCP5304
High Voltage, High and Low
Side Driver
outputs for direct drive of 2 N-channel power MOSFETs or IGBTs
arranged in a half-bridge configuration.
High-side power switch. The driver works with 2 independent inputs
with cross conduction protection.
Features
Typical Applications
© Semiconductor Components Industries, LLC, 2007
July, 2007 - Rev. 1
The NCP5304 is a High Voltage Power gate Driver providing two
It uses the bootstrap technique to insure a proper drive of the
High Voltage Range: up to 600 V
dV/dt Immunity ±50 V/nsec
Gate Drive Supply Range from 10 V to 20 V
High and Low Drive Outputs
Output Source / Sink Current Capability 250 mA / 500 mA
3.3 V and 5 V Input Logic Compatible
Up to V
Matched Propagation Delays between Both Channels
Outputs in Phase with the Inputs
Cross Conduction Protection with 100 ns Internal Fixed Dead Time
Under V
Pin-to-Pin Compatible with Industry Standards
These are Pb-Free Devices
Half-bridge Power Converters
Full-bridge Converters
CC
CC
Swing on Input Pins
LockOut (UVLO) for Both Channels
1
†For information on tape and reel specifications,
NCP5304PG
NCP5304DR2G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Device
NCP5304 = Specific Device Code
A
L or WL
Y or YY
W or WW = Work Week
G or G
CASE 751
CASE 626
ORDERING INFORMATION
D SUFFIX
P SUFFIX
IN_LO
SOIC-8
PDIP-8
1
IN_HI
GND
VCC
PINOUT INFORMATION
http://onsemi.com
1
8 Pin Package
= Assembly Location
= Wafer Lot
= Year
= Pb-Free Package
(Pb-Free)
(Pb-Free)
Package
SOIC-8
PDIP-8
1
2
3
4
Publication Order Number:
8
7
6
5
DIAGRAMS
8
1
VBOOT
DRV_HI
BRIDGE
DRV_LO
2500 / Tape & Reel
MARKING
NCP5304
50 Units / Rail
P5304
ALYW
Shipping
YYWW
G
AWLG
NCP5304/D

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ncp5304 Summary of contents

Page 1

... NCP5304 High Voltage, High and Low Side Driver The NCP5304 is a High Voltage Power gate Driver providing two outputs for direct drive of 2 N-channel power MOSFETs or IGBTs arranged in a half-bridge configuration. It uses the bootstrap technique to insure a proper drive of the High-side power switch. The driver works with 2 independent inputs with cross conduction protection ...

Page 2

... C3 GND 1 IN_LO 2 IN_HI NCP1395 3 Vcc 4 GND DRV_LO NCP5304 GND GND Figure 2. Typical Application Half Bridge Converter VCC VCC UV DETECT IN_HI CROSS GND CONDUCTION PREVENTION IN_LO GND NCP5304 VBOOT 7 DRV_HI 6 Bridge 5 DRV_LO C6 Q2 GND GND VBOOT 7 DRV_HI ...

Page 3

... J_max Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NCP5304 Pin Function Symbol V -0 ...

Page 4

... Both Integrated a dead time will be mesured and characterised. The first when IN_HI changes (High to Low and Low to High), and the second when HI_LO changes (High to Low and Low to High). These parameters will be updated after the characterization results. 5. Timing diagram definition see: Figure 5 and Figure 6. NCP5304 = -40° ...

Page 5

... Figure 4. Input/Output Timing Diagram IN_HI (IN_LO DRV_HI (DRV_LO) Figure 5. Propagation Delay and Rise / Fall Time Definition 50% IN_HI ton_HI DRV_HI 50% IN_LO toff_LO 90% DRV_LO Figure 6. Matching Propagation Delay NCP5304 50% 50 off 90% 90% 10% 10% 50% toff_HI 90% 10% Matching Delay1=ton_HI-ton_LO Matching Delay2=toff_HI-toff_LO http://onsemi.com ...

Page 6

... IN_HI IN_LO DRV_HI DRV_LO Internal Deadtime Figure 7. Input/Output Cross Conduction Output Protection Timing Diagram http://onsemi.com NCP5304 Internal Deadtime 6 ...

Page 7

... Figure 10. Turn OFF Propagation Delay vs. Supply Voltage ( 140 120 100 BRIDGE PIN VOLTAGE (V) Figure 12. High Side Turn ON Propagation Delay vs. VBRIDGE Voltage NCP5304 CHARACTERIZATION CURVES 140 120 100 -40 -20 Figure 9. Turn ON Propagation Delay vs. ) BOOT 120 100 ...

Page 8

... V , VOLTAGE (V) CC Figure 16. Turn OFF Falltime vs. Supply Voltage ( BOOT -40 Figure 18. Propagation Delay Matching Between High Side and Low Side Driver vs. Temperature NCP5304 140 120 100 Low Side -40 -20 Figure 15. Turn ON Risetime vs. Temperature ) 50 45 ...

Page 9

... V , VOLTAGE (V) CC Figure 21. High Level Input Voltage Threshold vs. Supply Voltage ( 3.5 3 2.5 2 1 VOLTAGE (V) CC Figure 23. Logic “0” Input Current vs. Supply Voltage ( BOOT NCP5304 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -40 -20 Figure 20. Low Level Input Voltage Threshold = V ) BOOT 2.5 2.0 1.5 1.0 0.5 0 -40 -20 Figure 22. High Level Input Voltage Threshold ...

Page 10

... V , VOLTAGE (V) CC Figure 27. Low Level Output Voltage vs. Supply Voltage ( 1.6 1.2 0.8 0 VOLTAGE (V) CC Figure 29. High Level Output Voltage vs. Supply Voltage ( NCP5304 -40 -20 Figure 26. Logic “1” Input Current vs. ) 1.0 0.8 0.6 0.4 0.2 0 -40 -20 Figure 28. Low Level Output Voltage vs. ...

Page 11

... CC BOOT 0.2 0.16 0.12 0.08 0. 100 200 300 HV PINS VOLTAGE (V) Figure 35. Leakage Current on High Voltage Pins (600 V) to Ground vs VDRV_HI) BRIGDE BOOT NCP5304 400 350 300 250 200 I Low Side src 150 100 -40 -20 Figure 32. Output Source Current vs. ) 600 500 ...

Page 12

... VOLTAGE (V) CC Figure 39. V Supply Current vs Voltage 10.0 9.8 9.6 V UVLO Startup CC 9.4 9.2 9.0 8.8 8.6 V UVLO Startup BOOT 8.4 8.2 8.0 -40 - TEMPERATURE (°C) Figure 41. UVLO Startup Voltage vs. Temperature NCP5304 100 -40 -20 Figure 38. V 400 300 200 100 -40 -20 Supply Figure 40 9.0 8.8 8.6 8.4 8.2 8.0 7.8 7.6 7 ...

Page 13

... GATE 100 200 300 400 SWITCHING FREQUENCY (kHz) Figure 45. I Consumption vs. Switching CC1 Frequency with 50 nC Load on Each Driver @ NCP5304 2.2 nF LOAD 500 600 0 100 SWITCHING FREQUENCY (kHz) Figure 44. I Frequency with 33 nC Load on Each Driver @ ...

Page 14

... G C SEATING PLANE - 0.25 (0.010 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NCP5304 PACKAGE DIMENSIONS SOIC-8 NB CASE 751-07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...

Page 15

... C 3.94 4.45 0.155 0.175 D 0.38 0.51 0.015 0.020 F 1.02 1.78 0.040 0.070 G 2.54 BSC 0.100 BSC H 0.76 1.27 0.030 0.050 J 0.20 0.30 0.008 0.012 K 2.92 3.43 0.115 0.135 L 7.62 BSC 0.300 BSC --- 10 --- 10 N 0.76 1.01 0.030 0.040 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your loca Sales Representative NCP5304/D ...

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