ncp5810c ON Semiconductor, ncp5810c Datasheet - Page 12

• Manufacturer Part Number: ncp5810c
• Description: Dual 1 W Output Amoled Driver Supply
• Manufacturer: ON Semiconductor

Layout Recommendations
careful attention to board layout and component
placement. To prevent electromagnetic interference (EMI)
problems and reduce voltage ripple of the device any high
current copper trace which see high frequency switching
should be optimized. Therefore, use short and wide traces
for power current paths and for power ground tracks.
the Schottky diode D1 / capacitor C4 and D2 (optional) / C3
are in the high frequency switching path where current flow
is discontinuous. These components (D1/C4) in one hand
and (D2/C3) in other hand should be placed as close as
possible to reduce parasitic inductance connection. Also it
is important to minimize the area of the SWP and SWN
nodes and used the ground plane under them to minimize
cross-talk to sensitive signals and IC. The exposed pad of
the package must be connected to ground plane of the board
that is important for EMI and thermal management. Also,
PGND and AGND pin connection must be connected to the
ground plane. In addition, the inductors track connection
L1, L2 and input bypass capacitor C1, C2 must be placed
shortly to the NCP5810C pins connection to reduce EMI.
Finally it is always good practice to keep the sensitive
tracks such as feedback connection (VS and FBN) away
from switching signal connections (SWP and SWN) by
laying the tracks on the other side of PCB. Figure 15 show
an example of optimized PCB layout.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Demo Board Available:
•
ORDERING INFORMATION
Specifications Brochure, BRD8011/D.
NCP5810CMUTXG
NCP5810CUMUTXG
The high speed operation of the NCP5810C demands
In this application both couples of elements formed by
The NCP5810GEVB/D evaluation board that configures the device in typical application to supply constant voltage.
Device
http://onsemi.com
UDFN-12 3x3 mm
LLGA-12 3x3 mm
NCP5810C
(Pb-Free)
(Pb-Free)
Package
12
Thermal Considerations
dissipation of the NCP5810C. The power dissipation is a
function of efficiency and output power. Hence, increasing
the output power requires better components selection. For
example, should one change inductors: larger inductor
value (in micro Henri) and/or lower DCR may improve
efficiency. Adding the optional Schottky diode D2
provides a lower drop when the current flowing from the
inductor to the load, thereby improving the boost converter
efficiency.
to the ground plane to used the PCB as a heatsink. This
ground should then be connected to an internal copper
ground plane with thermal via placed directly under the
package to spread out the heat dissipated by the NCP5810C
as depicted in Figure 15.
Careful attention must be paid to the internal power
The exposed thermal pad that is designed to be soldered
Figure 15. Recommended PCB Layout
3000 / Tape & Reel
3000 / Tape & Reel
Shipping
†