lt3580ems8e-trpbf Linear Technology Corporation, lt3580ems8e-trpbf Datasheet - Page 18

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lt3580ems8e-trpbf

Manufacturer Part Number
lt3580ems8e-trpbf
Description
Boost/inverting Dc/dc Converter With 2a Switch, Soft-start, And Synchronization
Manufacturer
Linear Technology Corporation
Datasheet
LT3580
Figure 9. Suggested Component Placement for Boost Topology
(Both DFN and MSOP Packages. Not to Scale). Pin 9 (Exposed
Pad) must be soldered directly to the local ground plane for
adequate thermal performance. Multiple vias to additional
ground planes will improve thermal performance.
18
APPLICATIONS INFORMATION
V
IN
Figure 11. Suggested Component Placement for Inverting Topology (Both DFN and MSOP Packages. Not to Scale).
Note cut in ground copper at diode’s cathode. Pin 9 (Exposed Pad) must be soldered directly to local ground plane
for adequate thermal performance. Multiple vias to additional ground planes will improve thermal performance.
C1
L1
V
OUT
D1
SW
C2
1
2
3
4
V
IN
GND
9
3580 F09
C1
L1
L2
8
7
6
5
VIAS TO GROUND
PLANE REQUIRED
TO IMPROVE
THERMAL
PERFORMANCE
V
OUT
SW
SHDN
SYNC
C2
D1
C3
1
2
3
4
Figure 10. Suggested Component Placement for SEPIC Topology
(Both DFN and MSOP Packages. Not to Scale). Pin 9 (Exposed
Pad) must be soldered directly to the local ground plane for
adequate thermal performance. Multiple vias to additional
ground planes will improve thermal performance.
V
IN
GND
9
3580 F11
C1
L1
L2
8
7
6
5
VIAS TO GROUND
PLANE REQUIRED
TO IMPROVE
THERMAL
PERFORMANCE
V
OUT
SW
D1
SYNC
SHDN
C2
C3
1
2
3
4
GND
9
3580 F10
8
7
6
5
VIAS TO GROUND
PLANE REQUIRED
TO IMPROVE
THERMAL
PERFORMANCE
SHDN
SYNC
3580fa

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