lp5522tmx National Semiconductor Corporation, lp5522tmx Datasheet - Page 4

• Manufacturer Part Number: lp5522tmx
• Description: Programmable Led Driver
• Manufacturer: National Semiconductor Corporation

Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note AN1112 : Micro SMD Wafer Level Chip
Scale Package.
Note 5: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. MIL-STD-883 3015.7
Note 6: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
) is dependent on the maximum operating junction temperature (T
= 125°C), the maximum power
A-MAX
J-MAX-OP
dissipation of the device in the application (P
), and the junction-to ambient thermal resistance of the part/package in the application (θ
), as given by the
D-MAX
JA
– (θ
following equation: T
= T
× P
).
A-MAX
J-MAX-OP
JA
D-MAX
Note 7: .Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 8: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 9: The current source is connected internally between V
an V
. The voltage across the current source, (V
- V
), is referred to a headroom voltage
IN
LED
IN
LED
(V
). Minimum headroom voltage is defined as the V
voltage when the LED current has dropped 10% from the value measured at V
= V
- 1V.
HR
HR
LED
IN
LP5522 Block Diagram
202172306
www.national.com
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