ncv8508b ON Semiconductor, ncv8508b Datasheet - Page 10

• Manufacturer Part Number: ncv8508b
• Description: Ncv8508b 5.0 V, 250 Ma Ldo With Watchdog And Reset
• Manufacturer: ON Semiconductor

Recommend Thermal Data for SOIC−8 EP Package
6. 1 oz. copper, 54 mm
7. 1 oz. copper, 717 mm
Junction−to−Lead (psi−JL, Y
Junction−to−Lead (psi−JPad, Y
Junction−to−Ambient (R
8−SOIC EP Half Symmetry
Pad is soldered to PCB copper
Figure 19. Internal Construction of the Package and PCB Layout for Multiple Pad Area
Parameter
2
2
copper area, 0.062” thick FR4.
qJA
copper area, 0.062” thick FR4.
, q
JL
JA
)
Jp
)
Without and without mold compound
)
With mold compound
Bottom view
Top view
min−pad board (Note 6)
http://onsemi.com
126
8.0
10
38
Test Conditions Typical Value
1”−pad board (Note 7)
9.0
24
64
Copper Pad Layout
25 x 25mm
Units
°C/W
°C/W
°C/W