ncv8518b ON Semiconductor, ncv8518b Datasheet - Page 4
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ncv8518b
Manufacturer Part Number
ncv8518b
Description
Ncv8518b Low Dropout Linear Regulator With Watchdog, Wake Up, Reset, And Enable
Manufacturer
ON Semiconductor
Datasheet
1.NCV8518B.pdf
(13 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ncv8518bPDR2G
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
ncv8518bPWR2G
Manufacturer:
ON Semiconductor
Quantity:
500
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Specific notes on thermal characterization conditions:
All boards are 0.062” thick FR4, 3” square, with varying amounts of copper heat spreader, in still air (free convection) conditions. Numerical
values are derived from an axisymmetric finite−element model where active die area, total die area, flag area, pad area, and board area are
equated to the actual corresponding areas.
1. 1 oz copper, 100 mm
2. 1 oz copper, 645 mm
3. “board” is defined as center of exposed pad soldered to board; this is the recommended number to be used for thermal calculations, as it
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
SO−8 Exposed Pad Package
Junction to case top (Y
Junction to lead1 (Y
Junction to board (Y
Junction to ambient (q
SO−16 Exposed Pad Package
Junction to case top (Y
Junction to lead1 (Y
Junction to board (Y
Junction to ambient (q
Input Voltage
ENABLE Voltage
Output Voltage
RESET Voltage
RESET Current
ESD Susceptibility (Human Body Model)
Logic Inputs/Outputs (Reset, WDI, Wake Up, Delay)
Operating Junction Temperature
Storage Temperature Range
Moisture Sensitivity Level
Lead Temperature Soldering: Reflow
best represents the primary heat flow path and is least sensitive to board and ambient properties.
(ENABLE may be connected to V
(RESET may be incidentally shorted either to V
SOIC−16 EP (Case 751R)
SOIC−8 EP (Case 751AC)
Leaded Part
Lead−Free Part
Parameter
JL1
JL1
JB
JB
JA
JA
) (Note 3)
) (Note 3)
2
2
60−150 sec above 183°C, 30 sec max at peak
60−150 sec above 217°C, 40 sec max at peak
JT
)
JT
)
)
)
(0.155 in
(1 in
)
)
2
) spreader area (includes exposed pad).
2
) spreader area (includes exposed pad).
IN
through an external 20k resistor without damage)
Rating
100 sq. mm spreader board (Note 1)
100 sq. mm spreader board (Note 1)
OUT
or to GND without damage)
http://onsemi.com
Board/Mounting Conditions Typical Value
126
113
14
36
15
20
41
12
4
1 sq. inch spreader board (Note 2)
1 sq. inch spreader board (Note 2)
V
Symbol
V
I
ENABLE
V
RESET
RESET
MSL
V
T
OUT
T
−
−
−
−
IN
S
J
14
26
14
80
20
26
12
70
−0.3 to +7.0
0 V to V
−0.3 to +7.0
−55 to +150
−0.3 to 45
−0.3 to 16
−40 to150
Internally
240 peak
265 peak
Limited
Value
2.0
1
3
OUT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
mA
kV
°C
°C
°C
°C
V
V
V
V
V