lm7332mmx National Semiconductor Corporation, lm7332mmx Datasheet - Page 17

• Manufacturer Part Number: lm7332mmx
• Description: Dual Rail-to-rail Input/output 30v, Wide Voltage Range, High Output Operational Amplifier
• Manufacturer: National Semiconductor Corporation

Similarly, the power capability at 125°C is given by:
For MSOP package:
For SOIC package:
Figure 4 shows the power capability vs. temperature for
MSOP and SOIC packages. The area under the maximum
thermal capability line is the operating area for the device.
When the device works in the operating area where P
less than P
below 150°C. If the intersection of ambient temperature and
package power is above the maximum thermal capability line,
the junction temperature will exceed 150°C and this should
be strictly prohibited.
FIGURE 4. Power Capability vs. Temperature
D(MAX)
, the device junction temperature will remain
20187555
TOTAL
is
17
When high power is required and ambient temperature can't
be reduced, providing air flow is an effective approach to re-
duce thermal resistance therefore to improve power capabil-
ity.
APPLICATION HINTS ON SUPPLY DECOUPLING
The use of supply decoupling is mandatory in most applica-
tions. As with most relatively high speed/high output current
op amps, best results are achieved when each supply line is
decoupled with two capacitors; a small value ceramic capac-
itor (
to a large value Tantalum or Aluminum capacitor (> 4.7 µF).
The large capacitor can be shared by more than one device
if necessary. The small ceramic capacitor maintains low sup-
ply impedance at high frequencies while the large capacitor
will act as the charge “bucket” for fast load current spikes at
the op amp output. The combination of these capacitors will
provide supply decoupling and will help keep the op amp os-
cillation free under any load.
SIMILAR HIGH CURRENT OUTPUT DEVICES
The LM6172 has a higher GBW of 100 MHz and over 80 mA
of current output. There is also a single version, the LM6171.
The LM7372 has 120 MHz of GBW and 150 mA of current
output. The LM7372 is available in a small pin LLP package,
an 8-pin PSOP, and 16-pin SOIC packages with higher power
dissipation.
The LME49600 buffer has 250 mA of current out and a 110
MHz bandwidth. The LME49600 is available in a TO-263
package for higher power dissipation.
The LM7322 is a rail-to-rail input and output part with a slightly
higher GBW of 20 MHz. It has current capability of 40 mA
sourcing and 65 mA sinking, and can drive unlimited capaci-
tive loads. The LM7322 is available in both MSOP and SOIC
packages.
Detailed information on these parts can be found at
www.national.com.
∼
0.01 µF) placed very close to the supply lead in addition
www.national.com