MC74HC74ADR2 ON Semiconductor, MC74HC74ADR2 Datasheet
MC74HC74ADR2
Specifications of MC74HC74ADR2
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MC74HC74ADR2 Summary of contents
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MC74HC74A Dual D Flip−Flop with Set and Reset High−Performance Silicon−Gate CMOS The MC74HC74A is identical in pinout to the LS74. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device ...
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... Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Î Î Î Î ...
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... Current (per Package) Î Î Î Î Î Î Î Î Î Î Î Î Î NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). AC ELECTRICAL CHARACTERISTICS Î Î Î Î ...
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... ORDERING INFORMATION Device MC74HC74AN MC74HC74ANG MC74HC74AD MC74HC74ADG MC74HC74ADR2 MC74HC74ADR2G MC74HC74ADTR2 MC74HC74ADTR2G MC74HC74AF MC74HC74AFG MC74HC74AFEL MC74HC74AFELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb− ...
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CLOCK 50% 10 1/f max t t PLH PHL 90% 50% 10 TLH THL Figure 1. VALID 50% DATA 50% CLOCK Figure 3. 4, ...
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−T− SEATING PLANE 0.13 (0.005) PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE http://onsemi.com 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI ...
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... G −T− SEATING 14 PL PLANE 0.25 (0.010 14X 0.58 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE 0.25 (0.010 ...
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... S A −V− C 0.10 (0.004) −T− SEATING G D PLANE 14X 0.36 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE 0.25 (0.010) ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...