lpc11u12 NXP Semiconductors, lpc11u12 Datasheet - Page 62
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lpc11u12
Manufacturer Part Number
lpc11u12
Description
32-bit Arm Cortex-m0 Microcontroller; Up To 32 Kb Flash; 6 Kb Sram; Usb Device; Usart
Manufacturer
NXP Semiconductors
Datasheet
1.LPC11U12.pdf
(69 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Manufacturer:
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Company:
Part Number:
lpc11u12FBD48/201
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Part Number:
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Manufacturer:
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Company:
Part Number:
lpc11u12FHN33/201
Manufacturer:
NXP
Quantity:
1 000
Part Number:
lpc11u12FHN33/201
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
LPC11U1X
Product data sheet
Fig 36. Reflow soldering for the HVQFN33 (7x7) package
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 2 — 11 January 2012
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
LPC11U1x
© NXP B.V. 2012. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
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