MC74HC74ADG ON Semiconductor, MC74HC74ADG Datasheet
![IC FLIP FLOP DUAL D S/R 14-SOIC](/photos/6/57/65767/14-soic_751a_sml.jpg)
MC74HC74ADG
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MC74HC74ADG Summary of contents
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MC74HC74A Dual D Flip−Flop with Set and Reset High−Performance Silicon−Gate CMOS The MC74HC74A is identical in pinout to the LS74. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device ...
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... Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Î Î Î Î ...
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... Current (per Package) Î Î Î Î Î Î Î Î Î Î Î Î Î NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). AC ELECTRICAL CHARACTERISTICS Î Î Î Î ...
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... ORDERING INFORMATION Device MC74HC74AN MC74HC74ANG MC74HC74AD MC74HC74ADG MC74HC74ADR2 MC74HC74ADR2G MC74HC74ADTR2 MC74HC74ADTR2G MC74HC74AF MC74HC74AFG MC74HC74AFEL MC74HC74AFELG † ...
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−T− SEATING PLANE 0.13 (0.005) PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, ...
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... G −T− SEATING 14 PL PLANE 0.25 (0.010 14X 0.58 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE 0.25 (0.010 ...