mc9s08dn60 Freescale Semiconductor, Inc, mc9s08dn60 Datasheet - Page 309

• Manufacturer Part Number: mc9s08dn60
• Description: Hcs08 Microcontrollers
• Manufacturer: Freescale Semiconductor, Inc

The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving equations 1 and 2 for K gives:
Freescale Semiconductor
1
2
I/O
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Junction to Ambient Natural Convection
Num
1
2
3
is neglected) is:
T
θ
P
P
P
C
D
T
D
JA
A
D
int
I/O
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
Operating temperature range (packaged)
Maximum Junction Temperature
Thermal resistance
= Power dissipation on input and output pins — user determined
int
DD
+ P
Single-layer board
Four-Layer board
× V
I/O
I/O
DD
<< P
, Watts — chip internal power
K = P
2
int
Rating
and can be neglected. An approximate relationship between P
MC9S08DN60 Series Data Sheet, Rev 2
Table A-3. Thermal Characteristics
D
P
T
× (T
D
J
= K ÷ (T
J
= T
A
1
) in °C can be obtained from:
64-pin LQFP
48-pin LQFP
32-pin LQFP
64-pin LQFP
48-pin LQFP
32-pin LQFP
+ 273°C) + θ
A
+ (P
J
D
+ 273°C)
× θ
JA
JA
)
Symbol
× (P
θ
θ
θ
θ
θ
θ
T
T
JA
JA
JA
JA
JA
JA
A
J
D
)
2
–40 to 125
–40 to 105
–40 to 85
Value
135
Appendix A Electrical Characteristics
69
75
80
51
51
52
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
Temp.
Code
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
—
M
C
V
and T
309
J