msp430f2121irge Microchip Technology Inc., msp430f2121irge Datasheet - Page 12
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msp430f2121irge
Manufacturer Part Number
msp430f2121irge
Description
Msp430
Manufacturer
Microchip Technology Inc.
Datasheet
1.MSP430F2121IRGE.pdf
(52 pages)
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MSP430x21x1
MIXED SIGNAL MICROCONTROLLER
SLAS439C − SEPTEMBER 2004 − REVISED JULY 2006
absolute maximum ratings (see Note 1)
NOTES: 1. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
recommended operating conditions
NOTES: 1. The MSP430 CPU is clocked directly with MCLK.
NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum V CC of 2.2 V.
12
Supply voltage during program execution, V CC
Supply voltage during program/erase flash memory, V CC
Supply voltage, V SS
Operating free-air temperature range, T A
Operating free-air temperature range, T A
Processor frequency f SYSTEM
(Maximum MCLK frequency)
(Maximum MCLK frequency)
(see Notes 1, 2 and Figure 1)
(see Notes 1, 2 and Figure 1)
Voltage applied at V
Voltage applied to any pin (see Note 2)
Diode current at any device terminal
Storage temperature, T
Storage temperature, T
2. All voltages referenced to V SS . The JTAG fuse-blow voltage, V FB , is allowed to exceed the absolute maximum rating. The voltage
3. Higher temperature may be applied during board soldering process according to the current JEDEC J−STD−020 specification with
2. Modules might have a different maximum input clock specification. Refer to the specification of the respective module in this
3. This includes using the provided DCO calibration value for 12 MHz for V CC = 2.7 V to 3.6 V over the operating temperature range.
4. This includes using the provided DCO calibration value for 16 MHz for V CC = 3.3 V to 3.6 V over the operating temperature range.
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended
operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
is applied to the TEST pin when blowing the JTAG fuse.
peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
Both the high and low phase of MCLK must not exceed the pulse width of the specified maximum frequency.
datasheet.
16 MHz
12 MHz
6 MHz
CC
1.8 V
stg
stg
to V
(unprogrammed device, see Note 3)
(programmed device, see Note 3)
SS
2.2 V
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Ï Ï Ï Ï Ï Ï Ï Ï Ï
Ï Ï Ï Ï Ï Ï Ï Ï Ï
Ï Ï Ï Ï Ï Ï Ï Ï Ï
Ï Ï Ï Ï Ï Ï Ï Ï Ï
Ï Ï Ï Ï Ï Ï Ï Ï Ï
Ï Ï Ï Ï Ï Ï Ï Ï Ï
Ï Ï Ï Ï Ï Ï Ï Ï Ï
Ï Ï Ï Ï Ï Ï Ï Ï Ï
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage −V
POST OFFICE BOX 655303
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 1. Operating Area
2.7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I Version
T Version
V CC = 1.8 V, Duty Cycle = 50% ±10%
V CC = 2.7 V, Duty Cycle = 50% ±10%
(see Note 3)
V CC = 3.3 V, Duty Cycle = 50% ±10%
(see Note 4)
•
3.3 V 3.6 V
DALLAS, TEXAS 75265
. . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . .
Legend:
Ï Ï
Ï Ï
Ï Ï
Ï Ï
Ï Ï
Ï Ï
Supply voltage range,
during flash memory
programming
Supply voltage range,
during program execution
MIN
−40
−40
1.8
2.2
0
0
0
−0.3 V to V
NOM
−55°C to 150°C
0
−0.3 V to 4.1 V
−40°C to 85°C
MAX
105
3.6
3.6
CC
85
12
16
6
+0.3 V
±2 mA
UNIT
MHz
MHz
°C
°C
V
V
V