xr16m781il32 Exar Corporation, xr16m781il32 Datasheet - Page 4

• Manufacturer Part Number: xr16m781il32
• Description: 1.62v To 3.63v Uart With 64-byte Fifo And Vlio Interface
• Manufacturer: Exar Corporation

XR16M781
1.62V TO 3.63V UART WITH 64-BYTE FIFO AND VLIO INTERFACE
Pin Description
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
ANCILLARY SIGNALS
PwrSave
RESET#
XTAL1
XTAL2
DSR#
N
CTS#
DTR#
VCC
GND
GND
CD#
RI#
NC
AME
24-QFN
Center
P
Pad
18
17
19
13
11
IN
8
9
7
-
-
-
-
#
2, 15-18
32-QFN
Center
PIN#
Pad
24
22
25
26
27
10
23
28
13
11
9
25-BGA
P
A1
B3
C4
D5
C5
D4
A2
B1
B5
IN
-
-
-
-
#
T
Pwr
Pwr
Pwr
YPE
O
O
O
-
I
I
I
I
I
I
UART Clear-to-Send (active low) or general purpose input. It can
be used for auto CTS flow control, see EFR[7], MSR[4] and IER[7].
This input should be connected to VCC when not used.
UART Data-Terminal-Ready (active low) or general purpose output.
UART Data-Set-Ready (active low) or general purpose input. This
input should be connected to VCC when not used.
UART Carrier-Detect (active low) or general purpose input. This
input should be connected to VCC when not used.
UART Ring-Indicator (active low) or general purpose input. This
input should be connected to VCC when not used.
Crystal or external clock input.
Crystal or buffered clock output.
Power-Save (active high). This feature isolates the M781’s data bus
interface from the host preventing other bus activities that cause
higher power drain during sleep mode. See Sleep Mode with Auto
Wake-up and Power-Save Feature section for details. This pin does
not have an internal pull-down resistor. This input should be con-
nected to GND when not used.
Device reset (active low). A 40 ns minimum LOW pulse on this pin
will reset the internal registers and all outputs of the UART. The
UART transmitter output will be held HIGH, the receiver input will
be ignored and outputs are reset during reset period (see UART
Reset Conditions).
1.62V to 3.63V power supply.
Power supply common, ground.
The center pad on the backside of the QFN package is metallic and
should be connected to GND on the PCB. The thermal pad size on
the PCB should be the approximate size of this center pad and
should be solder mask defined. The solder mask opening should be
at least 0.0025" inwards from the edge of the PCB thermal pad.
No Connects.
4
D
ESCRIPTION
REV. 1.0.0