bc847bm3 ON Semiconductor, bc847bm3 Datasheet - Page 5
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bc847bm3
Manufacturer Part Number
bc847bm3
Description
General Purpose Transistor
Manufacturer
ON Semiconductor
Datasheet
1.BC847BM3.pdf
(6 pages)
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b1
1
e
3
D
2
−X−
E
b
2X
0.08 (0.0032)
−Y−
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
X
Y
0.0157
0.40
A
0.0157
0.0157
0.40
0.40
L
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
C
H
http://onsemi.com
BC847BM3T5G
E
CASE 631AA−01
SOT−723
STYLE 1:
ISSUE B
PIN 1. BASE
2. EMITTER
3. COLLECTOR
5
0.0157
0.40
0.0157
0.40
SCALE 20:1
0.039
1.0
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
Y14.5M, 1982.
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
FLASH, PROTRUSIONS OR GATE BURRS.
DIM
b1
H
A
C
D
b
E
e
L
E
inches
mm
MIN
0.45
0.15
0.25
0.07
1.15
0.75
1.15
0.15
MILLIMETERS
0.40 BSC
NOM
0.50
0.21
0.31
0.12
1.20
0.80
1.20
0.20
MAX
0.55
0.27
0.37
0.17
1.25
0.85
1.25
0.25
0.0059 0.0083 0.0106
0.0028 0.0047 0.0067
0.0059 0.0079 0.0098
0.018
0.010
0.045
0.045
MIN
0.03
0.016 BSC
INCHES
NOM
0.020
0.012
0.047
0.032
0.047
MAX
0.022
0.015
0.049
0.034
0.049