mr4a16b Everspin Technologies, Inc, mr4a16b Datasheet
mr4a16b
Available stocks
Related parts for mr4a16b
mr4a16b Summary of contents
Page 1
... The MR4A16B is available in small footprint 48-pin ball grid array (BGA) package and a 54-pin thin small outline package (TSOPII). These packages are compatible with similar low-power SRAM products and other nonvolatile RAM products. The MR4A16B provides highly reliable data storage over a wide range of temperatures. The product is of- fered with commercial temperature (0 to +70 °C), industrial temperature (-40 to +85 °C), and automotive temperature (-40 to +125 °C) range options. CONTENTS 1. DEVICE PIN ASSIGNMENT......................................................................... 3 2. ELECTRICAL SPECIFICATIONS................................................................. 4 3. TIMING SPECIFICATIONS.......................................................................... 7 4 ...
Page 2
... COLUMN DECODER DECODER SENSE AMPS BIT MEMORY ARRAY FINAL 16 WRITE DRIVERS UPPER BYTE WRITE ENABLE LOWER BYTE WRITE ENABLE Table 1.1 Pin Functions 2 Document Number: MR4A16B Rev. 5, 4/2010 MR4A16B UPPER 8 BYTE OUTPUT 8 BUFFER LOWER 8 8 BYTE OUTPUT BUFFER UPPER 8 DQU[15:8] BYTE 8 WRITE ...
Page 3
... TSOP Current DQL[7: Hi-Z SB1 SB2 I Hi-Z DDR I Hi-Z DDR I D DDR Out I Hi-Z DDR I D DDR Out I D DDW in I Hi-Z DDW I D DDW in Document Number: MR4A16B Rev. 5, 4/2010 DQU[15:8] 2 Hi-Z Hi-Z Hi-Z Hi-Z D Out ...
Page 4
... OUT BIAS T stg T Lead H max_write H max_read . The DC value of V must not exceed actual applied must not exceed applied MR4A16B 1 Value -0.5 to 4.0 -0 0.5 DD ±20 0.600 - - -45 to 130 -55 to 150 260 2000 8000 DD by more than 2V for 10ns with I Document Number: MR4A16B Rev. 5, 4/2010 Unit °C °C ° ...
Page 5
... Figure 2.1 Power Up and Power Down Diagram STARTUP TIME V DD BROWNOUT OR POWER LOSS NORMAL OPERATION 5 MR4A16B Typical Max 3.3 3.6 2 125 . As soon as V exceeds 0 (whichever is lower) and remain DD IH STARTUP TIME NORMAL OPERATION Document Number: MR4A16B Rev. 5, 4/2010 Unit °C (min), DD ...
Page 6
... Table 2.4 Power Supply Characteristics 0 ≥ 0 MR4A16B Typical Max - ±1 - ± Symbol Typical Max I 60 TBD DDR I 110 TBD DDW 110 TBD 110 TBD SB1 SB2 Document Number: MR4A16B Rev. 5, 4/2010 Unit μA μ Unit ...
Page 7
... Table 3.2 AC Measurement Conditions Figure 3.1 Output Load Test Low and High Figure 3.2 Output Load Test All Others 3.3 V Output 435 7 MR4A16B 1 Typical Max - I/O Value 1.5 1 3.0 2 See Figure 3.1 See Figure 3 1 590 5 pF Document Number: MR4A16B Rev. 5, 4/2010 Unit Unit ...
Page 8
... G≤ Figure 3.3B Read Cycle 2 t AVAV t AVQV t ELQV t ELQX t GLQV t GLQX t BLQV t BLQX 8 MR4A16B 1 Min Max Data Valid t EHQZ t GHQZ t BHQZ Data Valid Document Number: MR4A16B Rev. 5, 4/2010 Unit ...
Page 9
... WHQX Figure 3.4 Write Cycle Timing 1 (W Controlled) t AVAV t AVWH t AVWL t WLQZ MR4A16B 1 Min Max WHAX t WLEH t WLWH t t DVWH WHDX DATA VALID WHQX Document Number: MR4A16B Rev. 5, 4/2010 Unit ...
Page 10
... AVEH t ELEH t ELWH t ELEH t ELWH t DVEH t EHDX t EHAX Figure 3.5 Write Cycle Timing 2 (E Controlled) t AVAV t AVEH t AVEL Hi-Z 10 MR4A16B 1 Min Max EHAX t ELEH t ELWH t t EHDX DVEH Data Valid Document Number: MR4A16B Rev. 5, 4/2010 Unit ...
Page 11
... AVAV t AVBL t AVBH t AVBH t BLEH t BLWH t BLEH t BLWH t DVBH t BHDX t BHAX t AVAV t AVEH t t AVBL BLEH t BLWH MR4A16B 1 Min Max BHAX t t DVBH BHDX Data Valid Hi -Z Document Number: MR4A16B Rev. 5, 4/2010 Unit ...
Page 12
... ORDERING INFORMATION Part Number MR4A16BMA35 1 MR4A16BCMA35 MR4A16BMMA35 MR4A16BYS35 1 MR4A16BCYS35 1 MR4A16BMYS35 1 Note 1: These products are classified as Preliminary, a product in development and/or qualification that has fixed target specifications that are subject to change pending characterization results. Everspin Technologies © 2010 Figure 4.1 Part Numbering System Table 4.1 Available Parts Description 3.3 V 1Mx16 MRAM 48-BGA 3.3 V 1Mx16 MRAM 48-BGA 1 1Mx16 1 3.3 V MRAM 48-BGA 3.3 V 1Mx16 MRAM 54-TSOP 3.3 V 1Mx16 MRAM 54-TSOP 1Mx16 54-TSOP 3 ...
Page 13
... Max 1.27 1.35 0.27 0.32 1. Dimensions in Millimeters. 0.36 0.41 2. The ‘e’ represents the basic solder ball grid pitch. 3. ‘b’ is measurable at the maximum solder ball diameter 4. Dimension ‘ccc’ is measured parallel to primary datum 5. Primary datum C (seating plane) is defined by the 6. Package dimensions refer to JEDEC MO-205 Rev. G. 0.10 0.10 0.12 0.15 0.08 13 MR4A16B BOTTOM VIEW PIN A1 INDEX Print Version Not To Scale in a plane parallel to datum C. C. crowns of the solder balls. Document Number: MR4A16B Rev. 5, 4/2010 ...
Page 14
... Everspin Technologies © 2010 Figure 5.2 54-TSOP ⊕0.20(0.008 0.10 C Max 1.20 0.10 0.15 1.00 1.05 0.35 0.45 0.21 22.22 22.35 11.76 11.95 10.16 10.29 0.50 0. 0.25 - 8° 15° REF 15° REF 14 MR4A16B θ Print Version Not To Scale 1. Dimensions in Millimeters. 2. Package dimensions refer to JEDEC MS-024 Document Number: MR4A16B Rev. 5, 4/2010 θ 3 0.21(0.008)REF. 0.665(0.026)REF. GAGE PLANE 0.25 mm ...
Page 15
... Technologies products for any such unintended or unauthorized application, Buyer shall indemnify and hold Everspin Technologies and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Everspin Technologies was negligent regarding the design or manufacture of the part. Everspin™ and the Everspin logo are trademarks of Everspin Technologies, Inc. All other product or service names are the property of their respective owners. ©Everspin Technologies, Inc. 2009-2010 15 MR4A16B Document Number: MR4A16B Rev. 5, 4/2010 ...