ltm8027 Linear Technology Corporation, ltm8027 Datasheet - Page 16

• Manufacturer Part Number: ltm8027
• Description: 60v, 4a Dc/dc ?module Regulator
• Manufacturer: Linear Technology Corporation

LTM8027
APPLICATIONS INFORMATION
The junction-to-air and junction-to-board thermal resis-
tances given in the Pin Confi guration diagram may also
be used to estimate the LTM8027 internal temperature.
These thermal coeffi cients are determined per JESD 51-9
(JEDEC standard, test boards for area array surface mount
package thermal measurements) through analysis and
physical correlation. Bear in mind that the actual thermal
resistance of the LTM8027 to the printed circuit board
depends upon the design of the circuit board.
Table 2. Recommended Component Values and Confi guration
(T
16
V
10.5 to 60
20.5 to 60
10.5 to 52
A
10.5 to 40
20.5 to 40
4.5 to 60
7.5 to 60
4.5 to 40
4.5 to 40
7.5 to 40
4.5 to 56
4.5 to 55
IN
16 to 60
26 to 60
34 to 60
16 to 40
26 to 40
34 to 40
16 to 48
= 25°C. See Typical Performance Characteristics for load Conditions)
RANGE
(V)
V
–3.3
–12
(V)
3.3
2.5
3.3
12
15
18
–5
–8
24
12
15
18
24
OUT
5
8
5
8
2 × 4.7μF 2220 100V 5 × 100μF 1812 6.3V
2 × 4.7μF 2220 100V 4 × 100μF 1210 6.3V
2 × 4.7μF 2220 100V
2 × 4.7μF 2220 100V
2 × 4.7μF 2220 100V
2 × 4.7μF 2220 100V
2 × 4.7μF 2220 100V
2 × 4.7μF 2220 100V 5 × 100μF 1812 6.3V 8.5V to 15V Above Output
2 × 4.7μF 2220 100V 4 × 100μF 1210 6.3V 8.5V to 15V Above Output
2 × 4.7μF 2220 100V
2 × 4.7μF 2220 100V
2 × 10μF 2220 50V
2 × 10μF 2220 50V
2 × 10μF 2220 50V
2 × 10μF 2220 50V
2 × 10μF 2220 50V
1 × 10μF 2220 50V
1 × 10μF 2220 50V
1 × 10μF 2220 50V
C
IN
5 × 100μF 1812 6.3V
4 × 100μF 1812 6.3V
4 × 100μF 1210 6.3V
4 × 47μF 1210 10V
4 × 22μF 1210 16V
4 × 22μF 1210 16V
4 × 10μF 1812 25V
4 × 10μF 1812 25V
4 × 47μF 1210 10V
4 × 22μF 1210 16V
4 × 22μF 1210 16V
4 × 10μF 1812 25V
4 × 10μF 1812 25V
4 × 47μF 1210 10V
4 × 22μF 1210 16V
C
OUT
8.5V to 15V Above Output
BIAS1/BIAS2
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
The die temperature of the LTM8027 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8027. The bulk of the heat fl ow out of the LTM8027
is through the bottom of the module and the LGA pads
into the printed circuit board. Consequently a poor printed
circuit board design can cause excessive heating, result-
ing in impaired performance or reliability. Please refer to
the PCB Layout section for printed circuit board design
suggestions.
AUX
AUX
AUX
AUX
AUX
R
(kΩ)
90.9
56.2
44.2
36.5
26.7
90.9
56.2
44.2
36.5
26.7
90.9
56.2
301
162
487
301
162
301
162
ADJ
f
OPTIMAL
(kHz)
115
210
260
300
350
400
430
145
165
210
260
300
350
400
430
115
190
260
300
R
OPTIMAL
(kΩ)
75.0
59.0
48.7
40.2
31.6
28.7
75.0
59.0
48.7
40.2
31.6
28.7
90.9
59.0
48.7
154
124
102
154
(kHz)
f
160
230
350
500
500
500
500
185
240
315
500
500
500
500
500
155
230
350
500
MAX
R
(kΩ)
68.2
40.2
23.7
23.7
23.7
23.7
88.7
64.9
45.3
23.7
23.7
23.7
23.7
23.7
68.2
40.2
23.7
107
115
MAX
8027f