ltm4612 Linear Technology Corporation, ltm4612 Datasheet - Page 17
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ltm4612
Manufacturer Part Number
ltm4612
Description
Ultralow Noise 36vin, 15vout, 5a, Dc/dc ?module
Manufacturer
Linear Technology Corporation
Datasheet
1.LTM4612.pdf
(24 pages)
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Table 4. 5V Output
DERATING CURVE
Figures 18, 21
Figures 18, 21
Figures 18, 21
Figures 10, 13, 16
Figures 10, 13, 16
Figures 10, 13, 16
Heat Sink Manufacturer
Wakefi eld Engineering
Safety Considerations
The LTM4612 modules do not provide isolation from V
to V
fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic
failure.
Layout Checklist/Example
The high integration of LTM4612 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid-
erations are still necessary.
• Use large PCB copper areas for high current path, in-
• Place high frequency ceramic input and output capaci-
• Place a dedicated power ground layer underneath the
• Use round corners for the PCB copper layer to minimize
• To minimize the EMI noise and reduce module thermal
APPLICATIONS INFORMATION
cluding V
PCB conduction loss and thermal stress.
tors next to the V
high frequency noise.
unit.
the radiated noise.
stress, use multiple vias for interconnection between
top layer and other power layers.
OUT
. There is no internal fuse. If required, a slow blow
IN
, PGND and V
D
, PGND and V
V
IN
OUT
36
36
36
36
36
36
(V)
. It helps to minimize the
OUT
Part No: LTN20069
pins to minimize
POWER LOSS CURVE
Figure 10
Figure 10
Figure 10
Figure 10
Figure 10
Figure 10
IN
• Do not put vias directly on pads.
• If vias are placed onto the pads, the the vias must be
• Interstitial via placement can also be used if necessary.
• Use a separated SGND ground copper area for com-
• Place one or more high frequency ceramic capacitors
Figure 17 gives a good example of the recommended
layout.
AIR FLOW (LFM)
capped.
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
close to the connection into the system board.
V
GND
V
OUT
IN
200
400
200
400
C
0
0
OUT
C
IN
Figure 17. Recommended PCB Layout
C
OUT
C
IN
Phone: 603-635-2800
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
HEAT SINK
None
None
None
LTM4612
θ
JA
14.9
11.1
10.4
4612 F17
9.3
(°C/W)
10
14
17
SIGNAL
GND
4612f