si-3000ks Sanken Electric Co., Ltd., si-3000ks Datasheet - Page 3

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si-3000ks

Manufacturer Part Number
si-3000ks
Description
Surface-mount, Low Current Consumption, Low Dropout Voltage Linear Regulator Ics
Manufacturer
Sanken Electric Co., Ltd.
Datasheet
Example of Solder Pattern Design
Reference Data
*1 The inner frame stage on which a monolithic IC is mounted is
directly connected to the GND pins (pins 5 through 8). By
expanding the area of the copper connected to the GND pins,
the heat radiation can be improved. It is recommended to
design the solder pattern by opening the insulation film of the
solder patterns of pins 5, 6, 7, and 8, on the wide GND
pattern as shown in Figure 1.
• Calculating junction temperature
140
120
100
Thermal resistance vs. Copper area
80
60
40
Measure the temperature TL of the lead of the GND pin (pin 7) by using a thermocouple, and substitute the
measured value into the following expression to calculate the junction temperature.
L
10
(Reference value conforming to EIAJ
Standard ED-7402-1)
T
Symbol
j
e
=P
e1
b2
l2
e
L
1
2
D
Copper area (mm
Area of PC board : 40 40mm
e1
j–L
b
e
Dimensions (mm)
100
+ T
1.27 0.15
0.2 to 0.5
L+ 1+ 2
L
5.72
0.76
e
0.2
0.2
0.6
2
)
(
j–L
L
= 22 C/W)
1000
B
1
L
B
2
1.2
0.8
0.6
0.4
0.2
Power dissipation vs. Copper area
1
0
10
GND pattern
Tj=100 C Area of PC board : 40 40mm
e
Ta=25 C
Ta=50 C
Ta=80 C
Copper area (mm
e
8
1
e
100
Figure 1
e
7
2
e
2
)
6
3
l2
*1
e
SI-3000KS Series
b2
5
4
e1
b2
1000
l2
e1

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