ftr-k1ak005e-mb Fujitsu Microelectronics, Inc., ftr-k1ak005e-mb Datasheet - Page 8

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ftr-k1ak005e-mb

Manufacturer Part Number
ftr-k1ak005e-mb
Description
Power Relay 1 Pole - 12a
Manufacturer
Fujitsu Microelectronics, Inc.
Datasheet
RoHS Compliance and Lead Free Relay Information
1. General Information
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Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)
2. Recommended Lead Free Solder Profile
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Solder condition
3. Moisture Sensitivity
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4. Tin Whisker
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Relays produced after the specific date code that is indicated on each data sheet are lead-free
Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu.
All signal and power relays also comply with RoHS. Please refer to individual data
It has been verified that using lead-free relays in leaded assembly process will not cause any
“LF” is marked on each outer and inner carton. (No marking on individual relays).
Flow Solder condition:
Pre-heating:
Soldering:
Solder by Soldering Iron:
Soldering Iron
Temperature: maximum 360˚C
Duration:
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that
are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE, DecaBDE).
Moisture Sensitivity Level standard is not applicable to electromechanical relays.
Dipped SnAgCu solder is known as low risk tin whisker. No considerable length whisker was found by our in
house test.
now. All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
problems (compatible).
Recommended solder paste Sn-3.0Ag-0.5Cu.
We highly recommend that you confirm your actual solder conditions
maximum 120˚C
dip within 5 sec. at
260˚C solder bath
maximum 3 sec.
FTR-K1 SERIES
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