LMV225TL National Semiconductor Corporation, LMV225TL Datasheet - Page 20

• Manufacturer Part Number: LMV225TL
• Manufacturer: National Semiconductor Corporation

Physical Dimensions
inches (millimeters) unless otherwise noted
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGE SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE
(www.national.com).
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTER
CLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
4-Bump micro SMD
NS Package Number TLA04AAA
±
±
±
X1 = 1.014
0.030 mm X2 = 1.014
0.030 mm X3 = 0.600
0.075 mm
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