eclamp3343c Semtech Corporation, eclamp3343c Datasheet

eclamp3343c

Manufacturer Part Number

eclamp3343c

Description

Usb 2.0 & Usb Otg Emi/rfi Filter, Termination, And Esd Protection

Manufacturer

Semtech Corporation

Datasheet

1.ECLAMP3343C.pdf (9 pages)

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

eclamp3343c.WCT

Manufacturer:

SEMTECH/美国升特

Quantity:

20 000

Current page: 1 of 9
Download datasheet (225Kb)

The EClamp

termination and filtering requirements of USB On the Go

(OTG) and USB 2.0 low and full speed operation. The

termination is set by a 33 ohm resistor. The filtering

and edge rate control is accomplished with 47pF

capacitors on each USB data line. This device is also

designed to provide electrostatic discharge (ESD)

protection in excess of 15kV (Air) and 8kV (Contact)

per IEC 61000-4-2, level 4 on both data (D+, D-) lines

as well as the voltage bus and ID pins.

USB upstream and downstream port are identified by

terminating the data lines with either a pull up resisitor

or pull down resistor. This device may be used on

either type of port by changing the pin connections.

For upstream applications, separate bumps are pro-

vided for protection of the VBus line (5.25V) and the

pull up resistor connection to the 3.3V supply (V

required by the USB specification. For downstream

applications, this device also supplies the option for

15k

For USB OTG applications, the device can be

configured as upstream(peripheral) by connecting a

1.5k

supply. To configure the device as a downstream(host),

15k

D+ and D- lines to ground. TVS diodes provide ESD

protection of both (D+ and D-) data lines, the ID pin,

and the voltage bus (V

Revision 09/01/04

PROTECTION PRODUCTS

PROTECTION PRODUCTS - EMIClamp

Description

Circuit Diagram

pulldown resistors on the D+ and D- line.

pull-down resistors are connected from both the

pull-up resistor from the D+ line to the 3.3V

(D2)

(D1)

3343C is designed to satisfy the

B1,B3

15K

Rpd2

15K

RPd1

BUS

Rup

1.5K

B1,B3

5.25V

(ID)

(VBus)

TRM

) as

USB 2.0 & USB OTG EMI/RFI Filter,

Features

Mechanical Characteristics

Applications

Schematic & PIN Configuration

Termination, and ESD Protection

Compliant to USB 1.1, USB2.0 (low and full speed)

and USB OTG requirements

ESD protection for USB power (V

lines (D+ & D-) to IEC 61000-4-2 Level 4

33 Ohm series resistor

Connections for both 1.5K Ohm pull up resistors

and 15K Ohm pull down resistors

Separate connections for 5.25V V

supply voltage

Low TVS operating voltage (5.25V)

Low leakage current

Solid-state technology

11-bump, 0.5mm pitch, flip chip

Bump Diameter: 315+/-20 m

Non-conductive top side coating

Marking : Orientation Mark and Marking Code

Packaging : Tape and Reel per EIA 481

USB OTG

USB 2.0 Upstream Ports (Low and Full Speed)

USB 2.0 Downstream Ports (Low and Full Speed)

Cellular Handsets

Set Top Box

Portable Electronics

PC Peripherals

11-Bump Flip Chip TVS (Top/Ball Down View)

EClamp3343C

BUS

), ID, and data

www.semtech.com

and 3.3V

Related parts for eclamp3343c

eclamp3343c Summary of contents

Page 1

... USB 2.0 Upstream Ports (Low and Full Speed) USB 2.0 Downstream Ports (Low and Full Speed) Cellular Handsets Set Top Box Portable Electronics PC Peripherals Schematic & PIN Configuration A1 (VBus) 5.25V B1,B3 A4 (ID) 11-Bump Flip Chip TVS (Top/Ball Down View) B1,B3 1 EClamp3343C ), ID, and data BUS and 3.3V BUS ...

Page 2

... EClamp3343C > > ...

Page 3

... Reverse Voltage - V Normalized Pull Up Resistance vs. Temperature 1.04 1.03 1.02 1.01 1.00 0.99 0.98 0.97 0.96 -40 - Temperature (*C ) 2004 Semtech Corp. Normalized Series Resistance vs. Temperature 1.04 1.03 1.02 1.01 1.00 0.99 0.98 0.97 0. MHz - (V) R Normalized Pull Down Resistance vs. Temperature 1.04 1.02 1 0.98 0.96 - EClamp3343C ESD Clamping (-8kV Contact) - Temperature (* Temperature (*C ) www.semtech.com 85 85 ...

Page 4

... PROTECTION PRODUCTS Applications Information The EClamp3343C is designed for termination and ESD/EMI protection of USB ports operating to 12Mb/s. This includes USB 1.1, USB 2.0 (low and full speed options) and USB OTG. The device includes the necessary pull up and pull down resistors to configure standard USB ports for either upstream or down stream configuration ...

Page 5

... Gnd Figure 6. USB Upstream Schematic (Low Speed) A2 (D-) B1,B3 (Gnd) A3 (D+) A1 (VBus) B1,B3 (Gnd) 5.25V Figure 7. USB Upstream Layout (Low Speed) B1,B3 (Gnd) A4 VBus (NC) Vtrm Gnd B1,B3 (Gnd Gnd 5 EClamp3343C VBus (Vtrm) 3.3V Rup 1. (D-) (VBus) 5.25V 15K RPd1 B1,B3 (Gnd) B1,B3 B2 (NC) (Gnd (NC) (D+) ...

Page 6

... Figure 8. USB Downstream Schematic C1 (NC) Rup 1. (D+) (D+) 15K RPd1 B1,B3 (Gnd) B1,B3 (Gnd) B2 (Gnd (D-) (D-) 15K Rpd2 B1,B3 (Gnd) B1,B3 (Gnd) C4 (Gnd) Figure 9. USB Downstream Layout VBus D+ D- Gnd 2004 Semtech Corp. A1 (VBus) 5.25V B1,B3 (Gnd) A4 (NC) B1,B3 (Gnd) VBus EClamp3343C www.semtech.com ...

Page 7

... IPC/JEDEC standard J-STD-020 for assembly of small body components. During reflow, the component will self-align itself on the pad. 2004 Semtech Corp. EClamp3343C Recommended NSMD Pad and Stencil Aperture Assembly Guideline for Pb-Free Soldering The following are recommendations for the assembly ...

Page 8

... Sn63/Pb37 FOR STANDARD DEVICES OR Sn95.5/Ag3.8/Cu0.7 FOR Pb-FREE DEVICES. 0.50 0.25 11X Ø0.275 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 8 EClamp3343C 0.50-0.75 0.250±0.025 11X Ø.315±0.020 0. 0.43 www.semtech.com ...

Page 9

... EMIClamp and EClamp are marks of Semtech Corporation Tape Specifications Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 9 EClamp3343C ...

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