se2545a23 SiGe Semiconductor, se2545a23 Datasheet - Page 20

• Manufacturer Part Number: se2545a23
• Description: Dual Band 802.11n Wireless Lan Front End
• Manufacturer: SiGe Semiconductor

Package Handling Information
Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly. The SE2545A23 is capable of
withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or
in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that
the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For
details on both attachment techniques, precautions, and handling procedures recommended by SiGe, please refer to:
Branding Information
The device branding is shown in Figure 18.
218-DST-01 Rev 1.1 Aug-31-2006
SiGe’s Application Note: “Land Grid Array Module Solder Reflow & Rework Information”, Document Number 69-
APP-01.
SiGe’s Application Note: “Handling, Packing, Shipping and Use of Moisture Sensitive LGA”, Document Number
69-APP-02.
Part Number
Lot Code
Pin 1 Identifier
Figure 18: SE2545A23 Branding Information
Pin 1
SiGe
SE2545A23
Lot Code
Dual Band 802.11n Wireless LAN Front End
e4
Terminal Finish
Preliminary Information
SE2545A23
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