se2546a30 SiGe Semiconductor, se2546a30 Datasheet - Page 13

• Manufacturer Part Number: se2546a30
• Description: Dual Band 802.11n Wireless Lan Front End
• Manufacturer: SiGe Semiconductor

Package Information
Figure 3 and Figure 4 show the detailed device package diagram. The pads on the SiGe RF modules are plated with
gold over nickel, with a gold thickness of approx. 0.75 to 1.0 um. The modules can be reflowed onto FR4 based
material using eutectic Pb based or common tin based Pb free solder pastes.
209-DST-01 Rev 1.2 Oct-02-2006
GROUND OPENING
GROUND OPENING
Figure 4: SE2546A30 Detailed Package Diagram (209-POD-01_Rev_2p0)
DETAIL "A"
DETAIL "C"
C L
Figure 3: SE2546A30 Package Diagram (209-POD-01_Rev_2p0)
C L
C L
C L
GROUND OPENING
10
11
12
13
14
1
2
3
4
5
6
7
8
9
PAD OPENING
DETAIL "B"
DETAIL "D"
C L
GND
GND
(49)
(49)
48
15
C L
NOTES:
GND
GND
(49)
(49)
47
16
C L
GND
GND
GND
GND
(49)
(49)
(49)
(49)
GND
GND
(49)
(49)
46
17
C L
GND
GND
(49)
(49)
45
18
TOP SIDE
GND
GND
GND
GND
(49)
(49)
GND
GND
44
(49)
(49)
(49)
(49)
19
GND
GND
(49)
(49)
43
20
GND
GND
(49)
(49)
42
21
GND
GND
(49)
(49)
41
22
GND
GND
GND
GND
(49)
(49)
(49)
(49)
Dual Band 802.11n Wireless LAN Front End
GND
(49)
GND
(49)
40
23
GND
(49)
GND
(49)
39
24
38
37
36
35
34
33
32
31
30
29
28
27
26
25
GND
GND
38
37
36
35
34
33
32
31
30
29
28
27
26
25
39
24
40
GND
GND
23
DETAIL "A"
DETAIL "B"
DETAIL "A"
DETAIL "A"
GROUND
OPENING
GROUND
OPENING
GROUND
OPENING
GROUND
OPENING
GND
GND
41
22
GND
GND
BOTTOM SIDE
42
21
43
DETAIL "A"
DETAIL "A"
GND
GND
DETAIL "A"
DETAIL "A"
20
GROUND
OPENING
GROUND
OPENING
GROUND
OPENING
GROUND
OPENING
GND
GND
44
19
45
GND
GND
18
DETAIL "A"
DETAIL "A"
DETAIL "C"
DETAIL "A"
OPENING
OPENING
OPENING
OPENING
GROUND
GROUND
GROUND
GROUND
46
GND
GND
17
GND
GND
47
16
Preliminary Information
48
GND
GND
15
10
11
12
13
14
1
2
3
4
5
6
7
8
9
SE2546A30
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