maamgm0002-die Tyco Electronics, maamgm0002-die Datasheet - Page 7

• Manufacturer Part Number: maamgm0002-die
• Description: Amplifier, Distributed, 0.1w 1.0-18.0 Ghz
• Manufacturer: Tyco Electronics

Specifications subject to change without notice.
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1.0-18.0 GHz 0.1W Distributed Amplifier
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Europe: Tel. [phone], Fax[phone]
Asia/Pacific: Tel.[phone], Fax [phone]
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
Figure 5b. Required Bonding for Direct Application of Gate Bias.
Support circuitry typical of MMIC characterization fixture for CW testing.
RF
IN
Pad
V
GG
V
GG
100 pF
Applied Voltage (V)
V
DD
GG
-1.0 to -0.3
0.1 µF
before applying positive bias to V
HI
0.1 µF
100 pF
MID
V
LO
DD
V
GG
GND
% IDSS
25 - 50
MAAMGM0002-DIE
RO-P-DS-3047
RF
OUT
DD
to prevent
C
V 1.00