maamgm0003-die Tyco Electronics, maamgm0003-die Datasheet - Page 7

• Manufacturer Part Number: maamgm0003-die
• Description: 0.4w Variable Distributed Amplifier 1.0 - 15.0 Ghz
• Manufacturer: Tyco Electronics

Specifications subject to change without notice.
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Email: [e-mail]
0.4W Variable Distributed Amplifier
North America: Tel. [phone]
Europe: Tel. [phone], Fax[phone]
Asia/Pacific: Tel.[phone], Fax [phone]
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
RF
IN
Figure 8. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW testing.
100 pF
V
DD
V
GG
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0.1 µF
0.1 µF
HI
GG
before applying positive bias to V
100 pF
V
MID
DD
LO
100 pF
GATE
V
GG
GATE
Pad
MID
V
LO
HI
GG
GND
0.1 µF
Applied Voltage (V)
MAAMGM0003-DIE
-2.4 to -1.6
-4.0 to 0.0
RO-P-DS-3046 - -
Gate Control
RF
-5
-5
-5
OUT
DD
to prevent
V 1.00
% IDSS
Variable
~50
~35
~25
n/a