bcm352f110t300a00 Vicor Corporation, bcm352f110t300a00 Datasheet - Page 8

• Manufacturer Part Number: bcm352f110t300a00
• Description: Bcmtm Bus Converter
• Manufacturer: Vicor Corporation

Figure 17 — Hole location for push pin heat sink relative to V
Configuration Options
vicorpower.com
RECOMMENDED LAND PATTERN
RECOMMENDED LAND PATTERN
(With GROUNDING CLIPS)
(NO GROUNDING CLIPS)
TOP SIDE SHOWN
TOP SIDE SHOWN
800-735-6200
•
I Chip
V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00
NOTES:
1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],
3. V•I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY;
4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.
5. UNLESS OTHERWISE SPECIFIED:
6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)
FREE OF COPPER, ALL PCB LAYERS.
THIS PROVIDES 7.00 [0.275] COMPONENT
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]
CLEARANCE BETWEEN VICOR HEAT SINKS.
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],
THIS PROVIDES 8.50 [0.334] COMPONENT
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]
CLEARANCE BETWEEN VICOR HEAT SINKS.
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN
TO PUSH-PIN HOLES WILL BE THE SAME FOR
ALL FULL SIZE V•ICHIP PRODUCTS.
DIMENSIONS ARE MM [INCH].
TOLERANCES ARE:
X.X [X.XX] = ±0.3 [0.01]
X.XX [X.XXX] = ±0.13 [0.005]
SHOWN FOR REFERENCE. HEATSINK ORIENTATION AND
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.
Page 8 of 11
Rev. 1.6