mpxa6115ac6t1mpxa6115a Freescale Semiconductor, Inc, mpxa6115ac6t1mpxa6115a Datasheet - Page 4

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mpxa6115ac6t1mpxa6115a

Manufacturer Part Number
mpxa6115ac6t1mpxa6115a
Description
Mpxh6115a High Temperature Accuracy Integrated Pressure Sensor
Manufacturer
Freescale Semiconductor, Inc
Datasheet
Super Small Outline chip carrier (Case 1317).
current operation).
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85×C temperature
range. The output will saturate outside of the rated pressure
range.
MPXA6115A
4
Figure 2. Cross Sectional Diagram SSOP (Not to Scale)
Sealed Vacuum Reference
Fluoro Silicone
Figure 2
Figure 3
Figure 4
Wire Bond
Frame
Gel Die Coat
Lead
illustrates the absolute sensing chip in the basic
shows a typical application circuit (output source
shows the sensor output signal relative to
Absolute Element
P1
Die
Figure 4. Output versus Absolute Pressure
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Die Bond
Transfer Function:
V
V
TEMP = 0 to 85ºC
out
S
Thermoplastic
= 5.0 Vdc
Steel Cap
Stainless
= V
Case
s
* (.009*P-.095) ± Error
Pressure (ref: to sealed vacuum) in kPa
.
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXA6115A/
MPXH6115A series pressure sensor operating
characteristics, internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance
and long-term reliability. Contact the factory for information
regarding media compatibility in your application.
100 nF
A fluorosilicone gel isolates the die surface and wire bonds
MIN
MAX
Figure 3. Typical Application Circuit
(Output Source Current Operation)
+5.0 V
V
GND Pin 3
S
MPXH6115A
MPXA6115A
Pin 2
V
out
TYP
Pin 4
Freescale Semiconductor
47 pF
51 K
Sensors
to ADC

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