mtsm735k-ur-a Marktech Optoelectronics, mtsm735k-ur-a Datasheet - Page 5

• Manufacturer Part Number: mtsm735k-ur-a
• Description: 3.2 X 2.8mm Smd Type
• Manufacturer: Marktech Optoelectronics

PRECAUTION IN USE
Storage
Soldering
*After reflow soldering rapid cooling should be avoided.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
[ Recommended soldering pad design ]
Use the following conditions shown in the figure.
Pre-heat
Pre-heat time
Peak temperature
Soldering time
Condition
Recommended storage environment
Temperature:
Humidity:
Use within 7 days after opening of sealed vapor/ESD barrier bags.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
Fold the opened bag firmly and keep in dry environment.
2.5~5°C/sec.
2.2
Pre-heating
120sec. Max.
120~150°C
＜1 : Lead Solder＞
2.5~5°C/sec.
5
60% RH Max.
Reflow Soldering
o
120~150℃
120sec. Max.
240℃ Max.
10sec. Max.
Temperature-
profile 1
refer to
C ~ 30
Lead Solder
o
C (41
60sec. Max.
(UNIT:mm)
MTSM735K-UR-A
o
F ~ 86
240°C Max.
10sec. Max.
o
F)
180~200℃
120sec. Max.
260℃ Max.
10sec. Max.
refer to
Temperature-
profile 2
Lead – free Solder
VER.: 04 Date: 2007/11/04 Page: 4/6
1~5°C/sec.
＜2 : Lead-free Solder＞
Pre-heating
180~200°C
120sec. Max.
Temperature
Soldering time
1~5°C/sec.
3.2 x 2.8mm SMD TYPE
Hand Soldering
60sec. Max.
350℃ Max.
3sec. Max.
(one time only)
260°C Max.
10sec. Max.