maap-008509-mch000 M/A-COM, maap-008509-mch000 Datasheet - Page 5

• Manufacturer Part Number: maap-008509-mch000
• Description: Amplifier, Power, 8.5-10.5
• Manufacturer: M/A-COM

5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less
than 7 minutes. Refer to Application Note AN3017 for more detailed information.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge
bond techniques. For DC pad connections, use either ball or wedge bonds. For best
RF performance, use wedge bonds of shortest length, although ball bonds are also
acceptable.
Biasing Note: Must apply negative bias to V
V
Assembly and Bonding Diagram
Amplifier, Power, 10W
8.5—10.5 GHz
DD
to prevent damage to amplifier.
Figure 5. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW testing.
NOTE: Indicated Gate voltage pad (VGG 2) represents the nominal bias
condition. However, the device current can be increased or decreased
as required by bonding to either VGG 1 or VGG 3 (respectively).
V
V
GG
GG
0.1μF
0.1μF
RF
IN
100 pF
100 pF
GG
before applying positive bias to
0.1 μF
0.1 μF
100 pF
100 pF
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0.1 μF
0.1 μF
100 pF
100 pF
V
V
DD
DD
RF
OUT
Preliminary Information
MA08509D
Rev A