maapgm0012-die Tyco Electronics, maapgm0012-die Datasheet
maapgm0012-die
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maapgm0012-die Summary of contents
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... Radar Applications ♦ Satellite Communications Description The MAAPGM0012-DIE is a 3-stage, 50 mW, Ka-Band power amplifier with on-chip bias networks. This product is fully matched to 50 ohms on both the input and output. It can be used as a power amplifier stage driver stage in high power applications. ...
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... Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 1 Absolute Maximum Symbol 6 180 -55 to +150 STG Symbol Min Typ V V 4.0 5.0 D1 Visit www.macom.com for additional data sheets and product information. MAAPGM0012-DIE Units dBm V °C °C Max Unit 6.0 V 7.0 dBm 150 °C Note 2 °C ...
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... North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 32.0 32.5 33.0 33.5 34.0 Frequency (GHz) Figure 1. Output Power vs. Frequency at V 4.5 5.0 Drain Voltage (V) Visit www.macom.com for additional data sheets and product information. MAAPGM0012-DIE 34.5 35.0 35.5 36 And P =5dBm 5 GHz And P = 5dBm ...
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... Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 VDD = 4 32.0 32.5 33.0 33.5 Frequency (GHz) Figure 3. 1dB Compression Point vs. Drain Voltage 32.0 32.5 33.0 33.5 Frequency (GHz) Figure 4. Small Signal Gain and VSWR vs. Frequency at V Visit www.macom.com for additional data sheets and product information. MAAPGM0012-DIE VDD = 5 VDD = 6 34.0 34.5 35.0 35.5 36.0 GAIN Input VSWR Output VSWR 34.0 34.5 35.0 35.5 36 ...
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... GND:G Note: Chip edge to bond pad dimensions are shown to the center of the bond pad. Figure 5. Die Layout Pad RF: IN, OUT Visit www.macom.com for additional data sheets and product information. MAAPGM0012-DIE (150 mils) GND:G VD2 ...
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... GND:G IN GND GND GND:G GND:G GND:G GND:G GND:G GND:G Visit www.macom.com for additional data sheets and product information. MAAPGM0012-DIE V DD 0.1 µF 100 pF GND:G VD2 RF OUT OUT ...