maapgm0013-die Tyco Electronics, maapgm0013-die Datasheet - Page 5

• Manufacturer Part Number: maapgm0013-die
• Description: 200mw Ka-band Power Amplifier 32.0-36.0 Ghz
• Manufacturer: Tyco Electronics

Specifications subject to change without notice.
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200mW Ka-Band Power Amplifier
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Bond Pad Dimensions
Mechanical Information
Chip Size: 3.799 x 2.997 x 0.075 mm
2.829mm.
1.516mm.
0.150mm.
DC: VGG, VD1, VD2
Chip edge to bond pad dimensions are shown to the center of the bond pad.
RF: IN, OUT
0
Pad
0
IN
VG
VG
G ND:G
G ND:G
Figure 5. Die Layout
GND:G
GND:G
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VD1
VD1
GND:G
GND:G
GND:G
GND:G
G ND:G
G ND:G
G ND:G
G ND:G
Size ( µ m)
100 x 100
150 x 150
GND:G
GND:G
GND:G
GND:G
G ND:G
G ND:G
G ND:G
G ND:G
(150 x 118 x 3 mils)
VD1
VD1
OUT
MAAPGM0013-DIE
1.515mm.
2.997mm.
Size (mils)
4 x 4
6 x 6