maapgm0041-die Tyco Electronics, maapgm0041-die Datasheet - Page 6

• Manufacturer Part Number: maapgm0041-die
• Description: 1.3w X/ku-band Power Amplifier 11.0-15.0 Ghz
• Manufacturer: Tyco Electronics

Specifications subject to change without notice.
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1.3W X/Ku-Band Power Amplifier
North America: Tel. [phone]
Europe: Tel. [phone], Fax[phone]
Asia/Pacific: Tel.[phone], Fax [phone]
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
RF
IN
Figure 6. Recommended operational configuration. Wire bond as shown .
V
GG
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0.1 µF
100 pF
GG
100 pF
V
V
DD
GG
before applying positive bias to V
0.1 µF
V
DD
MAAPGM0041-DIE
DD
to prevent
RF
OUT