maapgm0042-die Tyco Electronics, maapgm0042-die Datasheet - Page 5

• Manufacturer Part Number: maapgm0042-die
• Description: 1.2w X/ku-band Power Amplifier 11.5-16.0 Ghz
• Manufacturer: Tyco Electronics

Specifications subject to change without notice.
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Email: [e-mail]
1.2W X/Ku-Band Power Amplifier
North America: Tel. [phone]
Europe: Tel. [phone], Fax[phone]
Asia/Pacific: Tel.[phone], Fax [phone]
Bond Pad Dimensions
0.0940mm
1.736mm.
0.239mm.
1.980mm
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
Mechanical Information
Chip Size: 2.980 x 1.980 x 0.075 mm
Chip edge to bond pad dimensions are shown to the center of the bond pad.
0
RF In and Out
Pad
0
Figure 5. Die Layout
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Size ( µ m)
100 x 200
200 x 150
150 x 150
(
117 x 78 x 3 mils)
MAAPGM0042-DIE
Size (mils)
4 x 8
8 x 6
6 x 6
0.940mm.