k4s560832b Samsung Semiconductor, Inc., k4s560832b Datasheet
k4s560832b
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k4s560832b Summary of contents
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... K4S560832B 256Mbit SDRAM * Samsung Electronics reserves the right to change products or specification without notice 8bit x 4 Banks Synchronous DRAM LVTTL Revision 0.2 May. 2000 CMOS SDRAM Rev. 0.2 May.2000 ...
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... K4S560832B Revision 0.1 (March 10, 2000) • Deleted -80 Product Specification • Changed the Current values of ICC5, ICC6 • Changed tOH of -75 Product from 2.7ns to 3ns • Changed the Bank select address in SIMPLIFIED TRUTH TABLE Notes 4. BA0 BA1 Low Low Low High High Low ...
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... CKE * Samsung Electronics reserves the right to change products or specification without notice. GENERAL DESCRIPTION The K4S560832B is 268,435,456 bits synchronous high data rate Dynamic RAM organized 8,392,608 words by 8 bits, fabri- cated with SAMSUNG's high performance CMOS technology. Syn- chronous design allows precise cycle control with the use of system clock I/O transactions are possible on every clock cycle ...
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... K4S560832B PIN CONFIGURATION (Top view) PIN FUNCTION DESCRIPTION Pin Name CLK System clock CS Chip select CKE Clock enable Address Bank select address 0 1 RAS Row address strobe CAS Column address strobe WE Write enable DQM Data input/output mask DQ ~ Data input/output ...
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... K4S560832B ABSOLUTE MAXIMUM RATINGS Parameter Voltage on any pin relative to Vss Voltage on V supply relative to Vss DD Storage temperature Power dissipation Short circuit current Note : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. ...
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... I CC3 Operating current (Burst mode) Refresh current Self refresh current Notes : 1. Measured with outputs open. 2. Refresh period is 64ms. 3. K4S560832B-TC** 4. K4S560832B-TL** 5. Unless otherwise noticed, input swing level is CMOS Test Condition Burst length = (min) CC1 RC ...
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... K4S560832B AC OPERATING TEST CONDITIONS Parameter AC input levels (Vih/Vil) Input timing measurement reference level Input rise and fall time Output timing measurement reference level Output load condition Output 870 (Fig output load circuit OPERATING AC PARAMETER (AC operating conditions unless otherwise noted) Parameter ...
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... K4S560832B AC CHARACTERISTICS (AC operating conditions unless otherwise noted) Parameter CAS latency=3 CLK cycle time CAS latency=2 CAS latency=3 CLK to valid output delay CAS latency=2 CAS latency=3 Output data hold time CAS latency=2 CLK high pulse width CLK low pulse width Input setup time ...
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... K4S560832B IBIS SPECIFICATION I Characteristics (Pull-up) OH 100MHz/ 100MHz/ Voltage 133MHz 133MHz Min Max (V) I (mA) I (mA) 3.45 -2.4 3.3 -27.3 3.0 0.0 -74.1 2.6 -21.1 -129.2 2.4 -34.1 -153.3 2.0 -58.7 -197.0 1.8 -67.3 -226.2 1.65 -73.0 -248.0 1.5 -77.9 -269.7 1.4 -80.8 -284.3 1.0 -88.6 -344.5 0.0 -93.0 -502.4 I Characteristics (Pull-down) OL 100MHz/ 100MHz/ Voltage 133MHz 133MHz Min Max (V) I (mA) I (mA) 0 0.0 0.0 0.4 27.5 70.2 0.65 41.8 107.5 0.85 51.6 133.8 1 58.0 151.2 1.4 70.7 187.7 1.5 72.9 194.4 1.65 75.4 202.5 1 ...
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... K4S560832B V Clamp @ CLK, CKE, CS, DQM & (V) I (mA) DD 0.0 0.0 0.2 0.0 0.4 0.0 0.6 0.0 0.7 0.0 0.8 0.0 0.9 0.0 1.0 0.23 1.2 1.34 1.4 3.02 1.6 5.06 1.8 7.35 2.0 9.83 2.2 12.48 2.4 15.30 2.6 18.31 V Clamp @ CLK, CKE, CS, DQM & (V) I (mA) SS -2.6 -57.23 -2.4 -45.77 -2.2 -38.26 -2.0 -31.22 -1.8 -24.58 -1.6 -18.37 -1.4 -12.56 -1.2 -7.57 -1.0 -3.37 -0.9 -1.75 -0.8 -0.58 -0.7 -0.05 -0.6 0.0 -0.4 0.0 -0.2 0.0 0.0 0.0 Minimum V clamp current DD (Referenced Voltage I (mA) Minimum V clamp current -10 -20 -30 -40 -50 -60 Voltage I (mA) Rev. 0.2 May.2000 ...
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... K4S560832B SIMPLIFIED TRUTH TABLE Command Register Mode register set Auto refresh Entry Refresh Self refresh Bank active & row addr. Read & Auto precharge disable column address Auto precharge enable Write & Auto precharge disable column address Auto precharge enable Burst Stop ...