hys64d32020gdl-6-b Infineon Technologies Corporation, hys64d32020gdl-6-b Datasheet
hys64d32020gdl-6-b
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hys64d32020gdl-6-b Summary of contents
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... – – – – B 200 Small Outli ne Dual -In- Line Memor y Modules ...
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Edition 2003-08 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany Infineon Technologies AG 2003. © All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of ...
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... – – – – B 200 Small Outli ne Dual -In- Line Memor y Modules ...
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... HYS64D32020GDL–[5/6/7/8]–B, HYS64D1600xGDL–[6/7/8]–B, Revision History: V1.2 Previous Version: V1.1 Page Subjects (major changes since last revision) all New data sheet template 6,7,26,16 Added Part number HYS64D32020GDL-5-B including SPD and 7 Updated Complinance Code 18 Added DDR400B AC characteristics added I 16,17 Corrected 256MB for speed sort –6 & –7 DD ...
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... Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.1 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.2 Current Specification and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5 SPD Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules 5 V1.2, 2003-08 ...
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... CK2 1.2 Description The HYS64D32020GDL–[5/6/7/8]–B and HYS64D1600xGDL–[6/7/8]–B are industry standard 200-Pin Small Outline Dual-In-Line Memory Modules (SO-DIMMs) organized as 32M designed with Double Data Rate Synchronous DRAMs (DDR SDRAM). A variety of decoupling capacitors are mounted on the PC board. The DIMMs feature serial presence detect based on a serial E ...
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... All part numbers end with a place code designating the silicon-die revision. Reference information available on request. Example: HYS64D32020GDL-6-B, indicating rev. B dies are used for SDRAM components. 2. The Compliance Code is printed on the module labels describing the speed sort (for example “PC2700”), the latencies and SPD code definition (for example “ ...
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... I SDA I/O SA0 - SA2 Input; O: Output; I/O: bidirectional In-/Output; AI: Analog Input; PWR: Power Supply; GND: Signal Ground; NC: Not Connected; NU: Not Usable 2) CKE1 and S1 are used on two bank modules only Table 4 Address Format Density Organization Memory Ranks 128MB 16M 64 1 256MB ...
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... DQ23 55 DQ24 56 DQ28 DQ25 60 DQ29 61 DQS3 62 DM3 Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules Front side Back side Pin # Symbol Pin # Symbol 65 DQ26 66 DQ30 67 DQ27 68 DQ31 (CB0) 72 (CB4) 73 (CB1) ...
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... Figure 1 Pin Configuration Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules front side back side 10 Pin Configuration V1.2, 2003-08 ...
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... RAS CAS WE CKE0 CKE1 V SPD DD V REF Figure 2 Block Diagram - One Rank 16M Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules CS LDQS DQS4 LDQS LDM LDM DM4 DQ32 I/O 0 I/O 0 DQ33 I/O 1 I/O 1 DQ34 I/O 2 I/O 2 DQ35 I/O 3 I/O 3 DQ36 ...
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... Note: DQ wiring may differ from that described in this drawing; however DQ/DM/DQS relationships are maintained as shown strap connections: V and Strap out (open DDR SDRAM SO-DIMM HYS64D32020GDL–[5/6/7/8]–B 12 Pin Configuration Serial Presence Detect (SPD) SCL SA0 A0 SDA SA1 A1 SA2 A2 ...
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... V Input Low (Logic0) Voltage IL(DC) V Input Voltage Level, IN(DC) CK and CK Inputs Input Differential Voltage, V ID(DC) CK and CK Inputs VI-Matching Pull-up VI Ratio Current to Pull-down Current Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules Symbol min –0.5 IN OUT V – – –1 ...
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... V. For a given output, it represents the maximum difference between pull-up and pull-down drivers due to process variation. 8) Inputs are not recognized as valid until 9) Values are shown per DDR SDRAM component Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules Values Min. Typ. Max. –2 2 – ...
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... for DDR266(A for DDR333 and DDR400B Auto-Refresh Current burst refresh RC RFCMIN Self-Refresh Current CKE 0.2 V; external clock on Operating Current 7 four bank interleaving with Burst Length = 4; see component data sheet. Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules V IL,MAX V ; IH,MIN for DQ, DQS and DM ...
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... I [component [component] with m and n number of components of rank 1 and 2; n=0 for 1 rank DDx DD3N modules currents are not included into calculations: module DDQ on load conditions 5) The module I values are calculated from the corrponent DDx Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules ...
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... I [component [component] with m and n number of components of rank 1 and 2; n=0 for 1 rank DDx DD3N modules currents are not included into calculations: module DDQ load conditions 5) The module I values are calculated from the corrponent DDx Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules ...
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... DQS falling edge hold time from CK (write cycle) Mode register set command cycle time Write preamble setup time Write postamble Write preamble Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules Symbol –6 DDR333 DDR400B Min. Max. Min. t – ...
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... A valid transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW previous write was in progress, DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules Symbol –6 DDR333 Min. ...
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... DQS-DQ skew (DQS and associated DQ signals) Data hold skew factor DQ/DQS output hold time DQS input low (high) pulse width (write cycle) Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules 0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1 OL(ac) Symbol –8 DDR200 Min Max ...
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... Auto precharge write recovery + precharge time Internal write to read command delay Exit self-refresh to non-read command Exit self-refresh to read command Average Periodic Refresh Interval Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules Symbol –8 –7 DDR200 DDR266A Min Max. Min. ...
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... For each of the terms, if not already an integer, round to the next highest integer. cycle time. 14) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device. Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules V = +2 CK/CK slew rate are 1 ...
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... WE (Write) Latency 21 DIMM Attributes 22 Component Attributes 23 tCK @ CLmax -0.5 (Byte 18) [ns] 24 tAC SDRAM @ CLmax -0.5 [ns] 25 tCK @ CLmax -1 (Byte 18) [ns] Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules 128MB 128MB 128MB Rank 1 Rank 1 Rank –6 –6 –7 HEX ...
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... JEDEC ID Code for Infineon 69 JEDEC ID Code for Infineon 70 JEDEC ID Code for Infineon 71 JEDEC ID Code for Infineon 72 Module Manufacturer Location 73 Part Number, Char 1 Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules 128MB 128MB 128MB Rank 1 Rank 1 Rank –6 –6 –7 ...
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... Part Number, Char 17 90 Part Number, Char 18 91 Module Revision Code 92 Test Program Revision Code 93 Module Manufacturing Date Year 94 Module Manufacturing Date Week Module Serial Number 99 -127 not used Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules 128MB 128MB 128MB ...
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... Table 14 SPD Codes for HYS64D32020GDL–[5/6/7/8]–B Byte# Description 0 Programmed SPD Bytes in E2PROM 1 Total number of Bytes in E2PROM 2 Memory Type DDR-I = 07h Row Addresses 4 # Number of Column Addresses DIMM Banks 6 Data Width (LSB) 7 Data Width (MSB) 8 Interface Voltage Levels 9 tCK @ CLmax (Byte 18) [ns] ...
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... Table 14 SPD Codes for HYS64D32020GDL–[5/6/7/8]–B Byte# Description 28 tRRDmin [ns] 29 tRCDmin [ns] 30 tRASmin [ns] 31 Module Density per Bank 32 tAS, tCS [ns] 33 tAH, TCH [ns] 34 tDS [ns] 35 tDH [ns not used 41 tRCmin [ns] 42 tRFCmin [ns] 43 tCKmax [ns] 44 tDQSQmax [ns] 45 tQHSmax [ns] ...
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... Table 14 SPD Codes for HYS64D32020GDL–[5/6/7/8]–B Byte# Description 76 Part Number, Char 4 77 Part Number, Char 5 78 Part Number, Char 6 79 Part Number, Char 7 80 Part Number, Char 8 81 Part Number, Char 9 82 Part Number, Char 10 83 Part Number, Char 11 84 ...
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... MIN. Detail of contacts 0.6 ±0.1 Burnished, no burr allowed Figure 4 Package Outlines – Raw Card A DDR-SDRAM SO-DIMM Module HYS64D32020GDL–[5/6/7/8]– B Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules 67.6 63.6 ±0.1 (2.45) 100 ±0.1 47.4 ±0.1 (2.15) ±0.1 200 0.45 ±0.03 29 Package Outlines 3 ...
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... MIN. Detail of contacts 0.6 ±0.1 Burnished, no burr allowed Figure 5 Package Outlines Raw Card C DDR SDRAM SO-DIMM Modules HYS64D1600xGDL–[6/7/8]–B Data Sheet HYS64D[1600x/32020]GDL–[5/6/7/8]–B Small Outline DDR SDRAM Modules 67.6 63.6 (2.45) ±0.1 ±0.1 47.4 ±0.1 (2.15) ±0.1 200 0.45 ±0.03 30 Package Outlines 2 ...
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Published by Infineon Technologies AG ...