m391t5263az3 Samsung Semiconductor, Inc., m391t5263az3 Datasheet - Page 2

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m391t5263az3

Manufacturer Part Number
m391t5263az3
Description
Ddr2 Unbuffered Sdram Module
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
UDIMM
Table of Contents
1.0 DDR2 Unbuffered DIMM Ordering Information ..........................................................................4
2.0 Features .........................................................................................................................................4
3.0 Address Configuration .................................................................................................................4
4.0 x64 DIMM Pin Configurations (Front side/Back side) ................................................................5
5.0 x72 DIMM Pin Configurations (Front side/Back side) ................................................................6
6.0 Pin Description ..............................................................................................................................6
7.0 Input/Output Function Description .............................................................................................7
8.0 Functional Block Diagram : .........................................................................................................8
9.0 Absolute Maximum DC Ratings .................................................................................................10
10.0 AC & DC Operating Conditions ...............................................................................................10
11.0 IDD Specification Parameters Definition ................................................................................12
12.0 Operating Current Table : ........................................................................................................13
13.0 Input/Output Capacitance ........................................................................................................14
14.0 Electrical Characteristics & AC Timing for DDR2-800/667/533 .............................................14
15.0 Physical Dimensions : ..............................................................................................................19
14.4 Timing parameters by speed grade (DDR2-533)
8.1 4GB, 512Mx64 Module - M378T5263AZ(H)3
8.2 4GB, 512Mx72 ECC Module - M391T5263AZ(H)3
10.1 Recommended DC Operating Conditions (SSTL - 1.8)
10.2 Operating Temperature Condition
10.3 Input DC Logic Level
10.4 Input AC Logic Level
10.5 AC Input Test Conditions
12.1 M378T5263AZ(H)3 : 4GB(256Mx8 *16) Module
12.2 M391T5263AZ(H)3 : 4GB(256Mx8 *18) ECC Module
14.1 Refresh Parameters by Device Density
14.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin
14.3 Timing parameters by speed grade (DDR2-800 and DDR2-667)
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DDR2 SDRAM
Rev. 1.1 July 2008

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