mt9v032c12stmes aptina, mt9v032c12stmes Datasheet - Page 9

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mt9v032c12stmes

Manufacturer Part Number
mt9v032c12stmes
Description
Mt9v032 1/3-inch Wide-vga Digital Image Sensor
Manufacturer
aptina
Datasheet
Package Dimensions
Figure 5:
0.40 ±0.05
PDF: 09005aef824c9998/Source: 09005aef824c999c
MT9V032_LDS_2.fm - Rev. B 3/07 EN
Seating
8.8
4X
plane
1.0 ±0.2
48X
47X
4.4
0.2
D
A
48-Pin CLCC Package Outline Drawing
over Ni plating, 1.27 microns
Notes:
5.215
Au plating, 0.50 microns
4.4
minimum thickness
minimum thickness
11.43
48
8.8
Lead finish:
1. Optical center = package center.
2. All dimensions are in millimeters.
1
TYP
0.8
5.715
0.8 TYP
1.7
B
1.75
5.715
4.84
48X R 0.15
5.215
for reference only
for reference only
1.400 ±0.125
MT9V032: 1/3-Inch Wide-VGA Digital Image Sensor
2.3 ±0.2
11.43
C
A
0.90
0.35
9
0.05
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Substrate material: alumina ceramic 0.7 thickness
Wall material: alumina ceramic
Lid material: borosilicate glass 0.55 thickness
Image
sensor die:
0.675 thickness
0.10 A
Ø0.20 A B C
V CTR
Optical
Optical area:
Maximum rotation of optical area relative to package edges: 1º
Maximum tilt of optical area relative to
Maximum tilt of optical area relative to
area
seating plane A : 50 microns
top of cover glass D : 100 microns
Ø0.20 A B C
Package Dimensions
10.9 ±0.1
©2006 Micron Technology, Inc. All rights reserved.
H CTR
CTR
Preliminary
Optical
center
10.9 ±0.1
First
clear
pixel
CTR
1

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