mt9v131i29stc aptina, mt9v131i29stc Datasheet - Page 12

• Manufacturer Part Number: mt9v131i29stc
• Description: Mt9v131 1/4-inch Soc Vga Cmos Digital Image Sensor
• Manufacturer: aptina

Figure 9:
PDF: 09005aef824c99b3/Source: 009005aef824c99bb
MT9V131_LDS_2.fm - Rev. B 3/07 EN
DIMENSIONS APPLY TO SOLDER
BALLS POST REFLOW. THE PRE-
REFLOW DIAMETER IS Ø0.33
SEATING PLANE
4.50
44X Ø0.35
0.10 A
0.75 TYP
44-Ball iCSP Package Outline
Notes:
A
2.25
1. All dimensions in millimeters.
2. iCSP package information is preliminary.
7.00 ±0.075
BALL A7
0.75 TYP
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2%Ag
4.50
C L
(FOR REFERENCE ONLY)
SOLDER MASK DEFINED BALL PADS: Ø 0.27
SUBSTRATE MATERIAL: PLASTIC LAMINATE
3.50 ±0.05
MT9V131: 1/4-Inch SOC VGA CMOS Digital Image Sensor
OR 96.5% Sn, 3%Ag, 0.5% Cu
BALL A1
0.22
ENCAPSULANT: EPOXY
(FOR REFERENCE ONLY)
C L
3.50 ±0.05
BALL A1 ID
2.25
0.375 ±0.075
7.00 ±0.075
B
0.95 (FOR REFERENCE ONLY)
0.575 ±0.050
1.17 ±0.10
12
0.175
Micron Technology, Inc., reserves the right to change products or specifications without notice.
0.100
(FOR REFERENCE
ONLY)
OPTICAL AREA
BALL A1
CORNER
MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES: 1º
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO TOP OF COVER GLASS: 0.3º
LID MATERIAL: BOROSILICATE GLASS 0.40 THICKNESS
IMAGE SENSOR DIE
3.400 ±0.075
PACKAGE
OPTICAL
CENTER
CENTER
3.500 ±0.075
Electrical Specifications
©2006 Micron Technology, Inc. All rights reserved.
3.584 CTR
5.30 CTR
B
: 0.3º
Preliminary
2.688
PIXEL
(0,0)
CTR
5.30
CTR