ppc440gx-3rf800cz Applied Micro Circuits Corporation (AMCC), ppc440gx-3rf800cz Datasheet - Page 62
ppc440gx-3rf800cz
Manufacturer Part Number
ppc440gx-3rf800cz
Description
Power Pc 440gx Embedded Processor
Manufacturer
Applied Micro Circuits Corporation (AMCC)
Datasheet
1.PPC440GX-3RF800CZ.pdf
(93 pages)
- Current page: 62 of 93
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440GX – Power PC 440GX Embedded Processor
62
Recommended DC Operating Conditions
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended
conditions can affect device reliability.
Input Capacitance
Output Max Allowable Overshoot (3.3V LVTTL)
Output Max Allowable Undershoot (3.3V LVTTL)
Case Temperature rating for C package and S package
Case Temperature rating E for C package
Case Temperature rating E for F package
Notes:
Group 1 (2.5V SSTL I/O)
Group 2 (3.3V LVTTL I/O)
Group 3 (PCI-X I/O)
Group 4 (Receivers)
Group 5 (3.3V tolerant CMOS I/O)
1. PCI-X drivers meet PCI-X specifications.
2. SV
3. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the
4. There are no OV
5. LPDL is least positive down level; MPUL is most positive up level.
6. Case temperature, T
PPC440GX. See “Absolute Maximum Ratings” on page 58.
to the chip I/O pins before OV
0.4V) before a new power- up cycle is started.
REF
= SV
DD
/2
DD
Parameter
, V
C
Parameter
, is measured at top center of case surface with device soldered to circuit board.
DD
, or SV
DD
DD
is applied to the chip. A power-down cycle should complete (OV
power supply power-up sequence requirements. However, external voltage should not be applied
Symbol
V
V
OMAU3
OMAO
T
T
T
(Continued)
C
C
C
Symbol
C
C
C
C
C
IN1
IN2
IN3
IN4
IN5
Minimum
-0.6
-40
-40
-40
Maximum
12
12
12
16
9
Typical
Revision 1.17 – July 16, 2008
DD
and V
Maximum
+105
+100
+3.9
Unit
+85
pF
pF
pF
pF
pF
DD
should both be below
Data Sheet
Unit
°C
°C
°C
V
V
Notes
Notes
AMCC
6
6
6
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