ppc460ex Applied Micro Circuits Corporation (AMCC), ppc460ex Datasheet - Page 96
![no-image](/images/no-image-200.jpg)
ppc460ex
Manufacturer Part Number
ppc460ex
Description
Powerpc 460ex Embedded Processor
Manufacturer
Applied Micro Circuits Corporation (AMCC)
Datasheet
1.PPC460EX.pdf
(98 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ppc460ex-SUA1000T
Manufacturer:
AMCC
Quantity:
250
Company:
Part Number:
ppc460ex-SUA600T
Manufacturer:
AMCC
Quantity:
40
Company:
Part Number:
ppc460ex-SUA800T
Manufacturer:
SAMSUNG
Quantity:
75
Company:
Part Number:
ppc460exR-CUB667T
Manufacturer:
AMCC
Quantity:
455
Company:
Part Number:
ppc460exR-SUB1000Z
Manufacturer:
AMCC
Quantity:
648
460EX – PPC460EX Embedded Processor
Revision Log
96
04/20/2007
05/17/2007
07/18/2007
08/03/2007
10/01/2007
10/17/2007
10/18/2007
12/21/2007
01/14/2008
02/11/2008
04/14/2008
05/05/2008
05/29/2008
07/17/2008
Date
Version
1.00
1.00
1.01
1.02
1.03
1.04
1.05
1.06
1.07
1.08
1.09
1.10
1.11
1.12
Initial creation of document.
Update to initial creation of document.
Update to initial creation of document.
Update to initial creation of document.
Eliminate SRIO, EMB, second RGMII, SMII, third and forth EMACs.
Change GPIOs to alternate to default signals.
Add thermal monitor diagram.
Corrected signal-to-pin (ball) assignments for nine pins.
Misc. updates and corrections.
Change all occurrences of PerDataPar to PerPar.
Swap signals assigned to balls A20 and E19.
Add updates from 460EX development which include changing the nine signal-to-pin changes
made for 1.03 back to their original state.
Restore TBI and RTBI to Features on first page.
Correct ActiveLow indication on some SATA and PCIE signals.
Correct ActiveLow indication on some SATA and PCIE signals.
Remove all GMC1xxxx signals.
Remove all TBI and RTBI signals.
Add missing GMC1RxCtl signal to pin AJ10.
Update I/O timing.
Change PCIE calibration resistor from 1k to 1.37k.
Add RMII signals.
Misc. updates.
Change maximum case temperature from +105°C to +85°C.
Correct typograhical errors.
Correct DDR SDRAM Read Data Path diagram.
Update PCIEnRefClk signal description.
Add block diagram from R/C engineering specification.
Reference 802.3 Ethernet spec for GMCMDIO timing.
Add KASUMI support to security.
Change document status from Advanced to Preliminary and remove Confidential status.
Update block diagram.
Add power estimates.
Flag SGMIIRefClk signals as not to be used.
Update Contents to include L2 Cache/SRAM.
Delete SAV
Change Thermal Monitor parameters (Doc Issue 504).
Misc. changes including Doc Issues 512, 524, and 526.
Add power sequence information (Doc Issue 455).
Doc Issue 530, 531, 536, 550.
DD
voltage from analog voltage filter diagram (Doc Issue 503).
Contents of Modification
Preliminary Data Sheet
Revision 1.12 – July 17, 2008
AMCC Proprietary