la62b-3-sbks8ug-8-as-pf Ligitek Electronics Co., Ltd., la62b-3-sbks8ug-8-as-pf Datasheet

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... LED ARRAY LA62B-3/SBKS8UG-8-AS-PF DOC REV DATE : LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET QW0905-LA62B-3/SBKS8UG-8-AS- Jun. - 2009 Pb Lead-Free Parts 發行 立碁電子 DCC ...

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... PART NO. LA62B-3/SBKS8UG-8-AS-PF Package Dimensions 2.54TYP 1 8UG LSBKS8UG2692-AS 1.5 MAX □ 0.5 TYP 2.0MIN 2.54TYP Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. 7.0 1.3 ± 0.5 2.9 5.08 2.9 ± 0.5 2.54TYP 2 3 SBKS 1.ANODE GREEN 2.COMMON CATHODE 3 ...

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... PART NO. LA62B-3/SBKS8UG-8-AS-PF Absolute Maximum Ratings at Ta=25 Parameter Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & ...

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... PART NO. LA62B-3/SBKS8UG-8-AS-PF Typical Electro-Optical Characteristics Curve SBK-S CHIP Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) Fig.3 Forward Current vs. Temperature Ambient Temperature( ℃ ) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current 1 ...

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... PART NO. LA62B-3/SBKS8UG-8-AS-PF Typical Electro-Optical Characteristics Curve 8UG CHIP Fig.1 Forward current vs. Forward Voltage 0.5 1.0 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 - Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0 500 550 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Fig.2 Relative Intensity vs. Forward Current 1 ...

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... PART NO. LA62B-3/SBKS8UG-8-AS-PF Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 120seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° ...

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... PART NO. LA62B-3/SBKS8UG-8-AS-PF Reliability Test: Test Item 1.Under Room Temperature Operating Life Test 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature 1.Ta=105 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature 1.Ta=-40 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 High Temperature 2.RH=90 %~95% High Humidity Test 3.t=240hrs 1 ...