k4m51163pc Samsung Semiconductor, Inc., k4m51163pc Datasheet

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k4m51163pc

Manufacturer Part Number
k4m51163pc
Description
Mobile Sdram
Manufacturer
Samsung Semiconductor, Inc.
Datasheet

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K4M51163PC - R(B)E/G/C/F
8M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PRO-
VIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could
result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or pro-
visions may apply.
FEATURES
• 1.8V power supply.
• LVCMOS compatible with multiplexed address.
• Four banks operation.
• MRS cycle with address key programs.
• EMRS cycle with address key programs.
• All inputs are sampled at the positive going edge of the system
• Burst read single-bit write operation.
• Special Function Support.
• DQM for masking.
• Auto refresh.
• 64ms refresh period (8K cycle).
• Commercial Temperature Operation (-25°C ~ 70°C).
• Extended Temperature Operation (-25°C ~ 85°C).
• 54Balls FBGA (-RXXX : Pb, -BXXX : Pb Free).
ORDERING INFORMATION
- R(B)E/G : Normal/Low Power, Extended Temperature(-25°C ~ 85°C)
- R(B)C/F : Normal/Low Power, Commercial Temperature(-25°C ~ 70°C)
Notes :
1. In case of 40MHz Frequency, CL1 can be supported.
Address configuration
clock.
-. CAS latency (1, 2 & 3).
-. Burst length (1, 2, 4, 8 & Full page).
-. Burst type (Sequential & Interleave).
-. PASR (Partial Array Self Refresh).
-. Internal TCSR (Temperature Compensated Self Refresh)
-. DS (Driver Strength)
-. DPD (Deep Power Down Mode)
K4M51163PC-R(B)E/G/C/F75
K4M51163PC-R(B)E/G/C/F90
K4M51163PC-R(B)E/G/C/F1L
Organization
Part No.
32M x 16
111MHz(CL=3)*
133MHz(CL=3), 83MHz(CL=2)
111MHz(CL=3), 83MHz(CL=2)
BA0, BA1
Bank
Max Freq.
1
, 66MHz(CL=2)
GENERAL DESCRIPTION
rate Dynamic RAM organized as 4 x 8,388,608 words by 16 bits,
fabricated with SAMSUNG’s high performance CMOS technol-
ogy. Synchronous design allows precise cycle control with the
use of system clock and I/O transactions are possible on every
clock cycle. Range of operating frequencies, programmable
burst lengths and programmable latencies allow the same
device to be useful for a variety of high bandwidth and high per-
formance memory system applications.
The K4M51163PC is 536,870,912 bits synchronous high data
A0 - A12
Row
Interface
LVCMOS
Mobile SDRAM
Column Address
54 FBGA Pb
A0 - A9
(Pb Free)
Package
February 2006

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k4m51163pc Summary of contents

Page 1

... GENERAL DESCRIPTION The K4M51163PC is 536,870,912 bits synchronous high data rate Dynamic RAM organized 8,388,608 words by 16 bits, fabricated with SAMSUNG’s high performance CMOS technol- ogy ...

Page 2

... K4M51163PC - R(B)E/G/C/F FUNCTIONAL BLOCK DIAGRAM Bank Select CLK ADD LCKE LRAS LCBR CLK CKE CS Data Input Register Column Decoder Latency & Burst Length Programming Register LWE LCAS Timing Register RAS CAS WE Mobile SDRAM LWCBR LDQM L(U)DQM ...

Page 3

... K4M51163PC - R(B)E/G/C/F < Bottom View *2: Top View *1: Bottom View < Top View #A1 Ball Origin Indicator Package Dimension and Pin Configuration *1 > > Mobile SDRAM *2 < Top View > 54Ball(6x9) FBGA VSS ...

Page 4

... K4M51163PC - R(B)E/G/C/F ABSOLUTE MAXIMUM RATINGS Parameter Voltage on any pin relative Voltage on V supply relative Storage temperature Power dissipation Short circuit current NOTES: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to recommended operating condition. ...

Page 5

... K4M51163PC - R(B)E/G/C/F DC CHARACTERISTICS Recommended operating conditions (Voltage referenced to V Parameter Symbol Operating Current I CC1 (One Bank Active) I CC2 Precharge Standby Current in power-down mode I CC2 I CC2 Precharge Standby Current in non power-down mode I CC2 I CC3 Active Standby Current in power-down mode I CC3 I CC3 Active Standby Current ...

Page 6

... K4M51163PC - R(B)E/G/C/F AC OPERATING TEST CONDITIONS Parameter AC input levels (Vih/Vil) Input timing measurement reference level Input rise and fall time Output timing measurement reference level Output load condition 1.8V 13.9KΩ Output 10.6KΩ Figure 1. DC Output Load Circuit = 1.7V ∼ 1.95V Value 0 0 tr/tf = 1/1 0 See Figure 2 VOH (DC) = VDDQ - 0 ...

Page 7

... K4M51163PC - R(B)E/G/C/F OPERATING AC PARAMETER (AC operating conditions unless otherwise noted) Parameter Row active to row active delay RAS to CAS delay Row precharge time Row active time Row cycle time Last data in to row precharge Last data in to Active delay Last data in to new col. address delay ...

Page 8

... K4M51163PC - R(B)E/G/C/F AC CHARACTERISTICS (AC operating conditions unless otherwise noted) Parameter CAS latency=3 CLK cycle time CAS latency=2 CAS latency=1 CAS latency=3 CLK to valid output delay CAS latency=2 CAS latency=1 CAS latency=3 Output data hold time CAS latency=2 CAS latency=1 CLK high pulse width ...

Page 9

... K4M51163PC - R(B)E/G/C/F SIMPLIFIED TRUTH TABLE COMMAND Register Mode Register Set Auto Refresh Entry Refresh Self Refresh Exit Bank Active & Row Addr. Read & Auto Precharge Disable Column Address Auto Precharge Enable Write & Auto Precharge Disable Column Address Auto Precharge Enable ...

Page 10

... K4M51163PC - R(B)E/G/C/F A. MODE REGISTER FIELD TABLE TO PROGRAM MODES Register Programmed with Normal MRS BA0 ~ BA1 Address A12 ~ A10/AP "0" Setting for Function Normal MRS Normal MRS Mode Test Mode A8 A7 Type Mode Register Set Reserved Reserved Reserved ...

Page 11

... K4M51163PC - R(B)E/G/C/F Partial Array Self Refresh 1. In order to save power consumption, Mobile SDRAM has PASR option. 2. Mobile SDRAM supports 3 kinds of PASR in self refresh mode : full array, 1/2 of full array, 1/4 of full array. BA1=0 BA1=0 BA0=0 BA0=1 BA1=1 BA1=1 BA0=0 BA0=1 - Full Array Internal Temperature Compensated Self Refresh (TCSR) Note : 1 ...

Page 12

... K4M51163PC - R(B)E/G/C/F C. BURST SEQUENCE 1. BURST LENGTH = 4 Initial Address BURST LENGTH = 8 Initial Address Sequential ...

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