tga4902-sm TriQuint Semiconductor, tga4902-sm Datasheet - Page 9

• Manufacturer Part Number: tga4902-sm
• Description: Ka-band Packaged Mpa
• Manufacturer: TriQuint Semiconductor

TriQuint Semiconductor Texas: Phone [phone] Fax [phone] Email: [e-mail] Web: www.triquint.com
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Time above Melting Point
Time within 5 C of Peak
Max Peak Temperature
Activation Time and
Reflow Profile
Ramp-down Rate
Ramp-up Rate
Temperature
Temperature
Recommended Surface Mount Package Assembly
TGA4902-SM
Part
Ordering Information
Typical Solder Reflow Profiles
60 – 120 sec @ 140 – 160 C
60 – 150 sec
4 – 6 C/sec
10 – 20 sec
QFN 4x4 Surface Mount
3 C/sec
SnPb
240 C
Package Style
Advance Product Information
60 – 180 sec @ 150 – 200 C
September 18, 2006
60 – 150 sec
4 – 6 C/sec
10 – 20 sec
Pb Free
3 C/sec
260 C
TGA4902-SM
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