tqm613025 TriQuint Semiconductor, tqm613025 Datasheet - Page 10

• Manufacturer Part Number: tqm613025
• Description: Cdma Cellular Band Pa/duplexer Module
• Manufacturer: TriQuint Semiconductor

PC Board Layout Recommendations
Figure 5: 7x4mm Module Package Drawing for Footprint Design
Center to Center
Figure 6: Recommended Copper Footprint for 7x4mm Module
Notes:
1. This drawing shows the recommended pin sizes and locations for mounting the module on a customer board.
2. Pins that are "No Connect" or that net to ground may be buried in any surface copper pour used for ground plane. TriQuint does
CDMA Cellular Band PA/Duplexer Module
0.9 mm
not recommend any thermal relief for surface ground pins. These pins should be buried in the surface copper.
Center to Center
0.9 mm
18
19
20
Centered On Each Face
1
20 Places (Reference,
0.5 mm X 0.5 mm
Module Bottom)
17
2
Pin 21 (Paddle or Backside Ground)
7.0 (Reference)
16
3
Through Package
15
Top View
4
0.78 mm X 0.50 mm
7.35 mm
20 Places
4.65 mm X 1.65 mm
14
5
Centered
1 Place
13
6
12
7
11
10
9
8
4.0 mm
(Ref)
4.35 mm
TQM613025
Data Sheet
10