msm521209 ETC-unknow, msm521209 Datasheet - Page 10

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msm521209

Manufacturer Part Number
msm521209
Description
131,072-word 9-bit Cmos Static
Manufacturer
ETC-unknow
Datasheet
¡ Semiconductor
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SOJ36-P-400-1.27
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
MSM521209
Epoxy resin
Cu alloy
Solder plating
5 mm or more
1.40 TYP.
(Unit : mm)
10/10

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