lv4924vh ON Semiconductor, lv4924vh Datasheet - Page 4

• Manufacturer Part Number: lv4924vh
• Description: Bi-cmos Ic Class-d Audio Power Amplifier Power Cell Btl 10wx2ch
• Manufacturer: ON Semiconductor

Overall view of substrate
Pd max-Ta
1. Data of the Exposed Die-Pad (heat spreader) substrate as mounted represents the value in the state where the exposed
2. For the set design, derating design should be made while ensuring allowance.
3. After set design, be sure to verify the design with the product.
Reference data for thermal design
Accordingly, these stresses must be as low or small as possible in the design.
Approximate targets for general derating are as follows:
Die-Pad surface is wet for 90% or more.
Stresses to become an object of derating are the voltage, current, junction temperature, power loss and mechanical
stresses including vibration, impact and tension.
Also check the soldered state of the Exposed Die-Pad, etc. and verify the reliability of the soldered joint.
If any void or deterioration is observed in these sections, thermal conduction to the substrate is deteriorated, resulting in
thermal damage of IC.
Mounted on a specified board (Customer bread board rev.1.0): 90.0mm × 70.0 mm × 1.6 mm (two-layer) Material: glass epoxy
(1) Maximum value 80% or less for the voltage rating.
(2) Maximum value 80% or less for the current rating.
(3) Maximum value 80% or less for the temperature rating.
4.6
3.2
6
5
4
0
--25
3
2
1
Exposed Die-Pad
Not Soldered
Exposed Die-Pad
Soldered
0
Ambient
LV4924VH
Specified board : 90.0 × 70.0 × 1.6mm
Pd max -- Ta
25
temperature, Ta -- C
50
glass epoxy
75
1.9
2.7
3
100
No.A1997-4/15